Synamic 6N PCB Manufacturers

Our enterprise insists all along the quality policy of "product high-quality is base of organization survival; customer gratification will be the staring point and ending of an company; persistent improvement is eternal pursuit of staff" and also the consistent purpose of "reputation very first, purchaser first" for Synamic 6N PCB,8MM thick PCB,SH260 high heat-resistant PCB,Synamic 6N Ultra Low Loss PCB,SH260 PCB, Hope we can easily generate a more glorious potential along with you by means of our endeavours within the long run.
Synamic 6N PCB, We have now won a good reputation among overseas and domestic clients. Adhering to the management tenet of "credit oriented, customer first, high efficiency and mature services", we warmly welcome friends from all walks of life to cooperate with us.

Hot Products

  • XC7V585T-2FFG1761C

    XC7V585T-2FFG1761C

    XC7V585T-2FFG1761C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Multilayer layers HDI PCB

    Multilayer layers HDI PCB

    Multilayer layers HDI PCB, press 3-6 layers first, then add 2 and 7 layers, and finally add 1 to 8 layers, a total of three times.The following is about 8 layers 3Step HDI, I hope to help you better understand 8 layers 3Step HDI.
  • XCZU9CG-2FFVC900I

    XCZU9CG-2FFVC900I

    ​XCZU9CG-2FFVC900I is a high-performance FPGA chip launched by Xilinx, which integrates rich functions and powerful performance, suitable for various complex application scenarios. Here are some of the main features and functions of the chip:
  • XC7VX485T-2FFG1157I

    XC7VX485T-2FFG1157I

    XC7VX485T-2FFG1157I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC2C128-7CPG132I

    XC2C128-7CPG132I

    XC2C128-7CPG132I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2S30F484I4N

    EP2S30F484I4N

    EP2S30F484I4N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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