Super thick PCB Manufacturers

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Hot Products

  • XC6SLX100-3FGG484I

    XC6SLX100-3FGG484I

    XC6SLX100-3FGG484I is an advanced field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 98,304 logic cells, 4.9 Mb of distributed RAM, 240 Digital Signal Processing (DSP) slices, and 8 clock management tiles. It requires a power supply of 1.2V to 1.5V and supports various I/O standards such as LVCMOS, LVDS, and PCI Express.
  • HI-35930PQIF

    HI-35930PQIF

    ​HI-35930PQIF is a CMOS integrated circuit produced by Holt Integrated Circuit Company, designed specifically for interfacing microcontrollers that support Serial Peripheral Interface (SPI) with ARINC 429 serial bus interface
  • XC7A25T-1CSG325C

    XC7A25T-1CSG325C

    XC7A25T-1CSG325C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM88823CA1KFSBG

    BCM88823CA1KFSBG

    BCM88823CA1KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S1400AN-4FGG676C

    XC3S1400AN-4FGG676C

    XC3S1400AN-4FGG676C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM63138SEKFSBG

    BCM63138SEKFSBG

    The BCM63138SEKFSBG is a high-performance multimedia gateway SoC (System-on-Chip) from Broadcom, a leading global semiconductor company specializing in wired and wireless communications technologies. This SoC is designed to meet the growing demands of multi-service and multimedia home gateway applications, providing a robust and scalable solution for telecom service providers.

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