Ro3010 PCB Manufacturers

Our company puts emphasis on the management, the introduction of talented personnel, and the construction of staff building, trying hard to improve the quality and liability consciousness of staff members. Our company successfully attained IS9001 Certification and European CE Certification of Ro3010 PCB,Ro3003 Material,Ro3006 PCB,Ro3210 PCB,Ro3035 PCB, Trust us and you will gain a lot more. You should truly feel totally free to make contact with us for additional data, we assure you of our greatest notice at all times.
Ro3010 PCB, Our solutions are widely recognized and trusted by users and can meet continuously changing of economic and social needs. We welcome new and old customers from all walks of life to contact us for future business relationships and mutual success!

Hot Products

  • BCM56565B0KFSBG

    BCM56565B0KFSBG

    BCM56565B0KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP4CE15F23I8LN

    EP4CE15F23I8LN

    EP4CE15F23I8LN is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • EP2AGX190FF35I3G

    EP2AGX190FF35I3G

    EP2AGX190FF35I3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM65500B1IFSBG

    BCM65500B1IFSBG

    BCM65500B1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU37P-L2FSVH2892E

    XCVU37P-L2FSVH2892E

    XCVU37P-L2FSVH2892E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU7P-3FLVC2104E

    XCVU7P-3FLVC2104E

    ​XCVU7P-3FLVC2104E also supports humidity sensitivity and adapts to different working environment requirements. The packaging form of this chip is BGA, which provides powerful logic processing capability and high-speed data transmission rate,

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