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Large size PCB, Faced with the vitality of the global wave of economic integration, we are confident with our high-quality products and sincerely service to all our customers and wish we can cooperate with you to create a brilliant future.

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  • EP3C5M164I7N

    EP3C5M164I7N

    EP3C5M164I7N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX75T-3FGG676C

    XC6SLX75T-3FGG676C

    XC6SLX75T-3FGG676C is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. It offers a large number of logic cells, distributed memory, and DSP slices, making it suitable for a wide range of applications. This device has 74,880 logic cells, 3.5 Mb of distributed RAM, 180 DSP slices, and 8 clock management tiles.
  • 10CL120YF780I7G

    10CL120YF780I7G

    ​10CL120YF780I7G Programmable Logic Device (CPLD/FPGA) Intel/LTERA/Altra BGA 23+/24+
  • HI-1574PST

    HI-1574PST

    HI-1574PST is a 16 channel discrete to digital interface circuit produced by Holt Integrated Circuits
  • XC7K325T-1FFG900C

    XC7K325T-1FFG900C

    ​XC7K325T-1FFG900C is a high-performance, step-down DC-DC power module developed by Analog Devices, a leading semiconductor technology company. This device features a wide input voltage range of 6V to 36V and a maximum output current of 5A.
  • TPS7A4901DGNR

    TPS7A4901DGNR

    TPS7A4901DGNR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • Definition and cause of pink circle on circuit board PCB

    After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.

  • The origin of 50 ohms in impedance matching

    For traces with a certain width, three main factors will affect the impedance of PCB traces. First of all, the EMI (electromagnetic interference) of the near field of the PCB trace is proportional to the height of the trace from the reference plane. The lower the height, the smaller the radiation. Secondly, the crosstalk will change significantly with the height of the trace. If the height is reduced by half, the crosstalk will be reduced to nearly a quarter.

  • Classification of chips

    Chip classification Is there a systematic classification method for so many chips? There are actually many ways to classify chips

  • Heavy copper PCB manufacturing

    Just like the standard PCB manufacturing method, heavy copper PCB manufacturing requires more delicate processing.

  • Distinguishing method of PCB single-layer board and multi-layer board

    According to the number of layers, single-sided, double-sided and multilayer circuit boards are divided according to the circuit layer inside.

  • FPC flexible circuit board through hole mode

    At present, most of the holes drilled in the double-sided flexible printed board are still drilled by the NC drilling machine. The NC drilling machine is basically the same as that used in the rigid printed board, but the drilling conditions are different. Because the flexible printed board is very thin, multiple pieces can be overlapped for drilling. If the drilling conditions are good, 10 ~ 15 pieces can be overlapped for drilling.

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