I-Speed PCB Manufacturers

Assume full accountability to fulfill all demands of our purchasers; attain continual advancements by marketing the advancement of our clientele; grow to be the final permanent cooperative partner of purchasers and maximize the interests of purchasers for I-Speed PCB,370HR PCB,185HR PCB,MT77 PCB,FR406 PCB, Because we stay with this line about 10 years. We got most effective suppliers support on excellent and cost. And we had weed out suppliers with poor high quality. Now several OEM factories cooperated with us too.
I-Speed PCB, So We also continuously function. we, focuse on high quality, and are conscious of the importance of environmental protection, most of the merchandise are pollution-free, environmentally friendly products and solutions, reuse on the solution. We have Updated our catalog, which introduces our organization. n detail and covers the primary products we deliver at present, You may also visit our web-site, which involves our most recent product line. We look forward to reactivating our company connection.

Hot Products

  • 5CGXFC9E6F35C7N

    5CGXFC9E6F35C7N

    ​5CGXFC9E6F35C7N is an FPGA chip belonging to the Cyclone V GX series produced by Intel (formerly known as Altera). This chip has the following characteristics and parameters:
  • 40-layer M6G high speed PCB

    40-layer M6G high speed PCB

    When the 40-layer M6G high speed PCB is close to the parallel high-speed differential signal line pair, in the case of impedance matching, the coupling of the two lines will bring many advantages. However, it is believed that this will increase the attenuation of the signal and affect the transmission distance.
  • XC6SLX45-2CSG484I

    XC6SLX45-2CSG484I

    XC6SLX45-2CSG484I has 43661 logic components, 2.04 Mbit embedded memory, minimum operating temperature bit -40 C, maximum operating temperature bit+100 C. Provide industry-leading connectivity features such as high logic pin ratio, small-sized packaging, MicroBlaze? Soft processors, and various supported I/O protocols. It is an ideal choice for advanced bridging applications in consumer products, automotive information and entertainment systems, and industrial automation applications
  • Robot 3step HDI PCB

    Robot 3step HDI PCB

    The heat resistance of the Robot 3step HDI PCB is an important item in the reliability of HDI. The thickness of the Robot 3step HDI Circuit Board becomes thinner and thinner, and the requirements for its heat resistance are getting higher and higher. The advancement of the lead-free process has also increased the requirements for the heat resistance of HDI boards. Since the HDI board is different from the ordinary multilayer through-hole PCB board in terms of layer structure, the heat resistance of the HDI board is the same as that of ordinary multilayer through-hole PCB board is different.
  • XCVU095-1FFVA2104I

    XCVU095-1FFVA2104I

    ​XCVU095-1FFVA2104I is an FPGA chip produced by Xilinx, belonging to the UltraScale architecture series. This chip is packaged in FCBGA 2104 and features high-performance FPGA logic that can be configured as distributed memory. It has 36Kb dual port block RAM and built-in FIFO logic for on-chip data bufferin
  • XC6SLX75T-3FGG676C

    XC6SLX75T-3FGG676C

    XC6SLX75T-3FGG676C is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. It offers a large number of logic cells, distributed memory, and DSP slices, making it suitable for a wide range of applications. This device has 74,880 logic cells, 3.5 Mb of distributed RAM, 180 DSP slices, and 8 clock management tiles.

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