High speed Backplane Manufacturers

Our pursuit and corporation aim should be to "Always satisfy our consumer requirements". We carry on to build and style and design remarkable quality items for both our outdated and new clients and reach a win-win prospect for our clients at the same time as us for High speed Backplane,68-layer high-speed backplane,NELCO high frequency board,ISOLA Tachyon 100G high speed board, Our tenet is "Reasonable price ranges, efficient manufacturing time and finest service" We hope to cooperate with additional consumers for mutual advancement and positive aspects.
High speed Backplane, Satisfaction and good credit to every customer is our priority. We focus on every detail of order processing for customers till they have received safe and sound products with good logistics service and economical cost. Depending on this, our products and solutions are sold very well in the countries in Africa, the Mid-East and Southeast Asia.

Hot Products

  • XCKU3P-2FFVB676E

    XCKU3P-2FFVB676E

    ​XCKU3P-2FFVB676E is a high-performance FPGA (Field Programmable Gate Array) chip launched by Xilinx. This chip belongs to the UltraScale architecture and has excellent cost-effectiveness, performance, and power consumption performance, making it particularly suitable for applications such as packet processing,
  • HI-3210PCIF

    HI-3210PCIF

    The HI-3210PCIF is a highly integrated data management engine designed specifically for ARINC 429 communication. It features eight ARINC 429 receive channels and four ARINC 429 transmit channels, enabling efficient data transfer between avionics systems
  • BCM88470CB0KFSBG

    BCM88470CB0KFSBG

    BCM88470CB0KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EM-888 7MM Thick PCB

    EM-888 7MM Thick PCB

    EM-888 7MM Thick PCB--As user applications require more and more board layers, alignment between layers becomes very important. Alignment between layers requires tolerance convergence. As the board size changes, this convergence requirement is more demanding. All layout processes are generated in a controlled temperature and humidity environment. The following is about EM888 7MM Thick PCB related, I hope to help you better understand EM888 7MM Thick PCB.
  • PM-DB2791S

    PM-DB2791S

    PM-DB2791S is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • LT1764AET#PBF

    LT1764AET#PBF

    LT1764AET#PBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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