High Tg PCB Manufacturers

"Control the quality by the details, show the strength by quality". Our company has strived to establish a highly efficient and stable staff team and explored an effective quality control process for High Tg PCB,S1000-2M PCB,S1000-2 PCB,S1000H PCB,S1190 PCB, We sincerely welcome buddies to negotiate business enterprise and start cooperation with us. We hope to join hands with good friends in different industries to produce a brilliant long term.
High Tg PCB, Our tenet is "integrity first, quality best". We now have confidence in providing you with excellent service and ideal goods. We sincerely hope we can establish win-win business cooperation with you in the future!

Hot Products

  • Robot PCB

    Robot PCB

    The heat resistance of the Robot PCB is an important item in the reliability of HDI. The thickness of the Robot 3step HDI Circuit Board becomes thinner and thinner, and the requirements for its heat resistance are getting higher and higher. The advancement of the lead-free process has also increased the requirements for the heat resistance of HDI boards. Since the HDI board is different from the ordinary multilayer through-hole PCB board in terms of layer structure, the heat resistance of the HDI board is the same as that of ordinary multilayer through-hole PCB board is different.
  • EP4SGX360KF40C3N

    EP4SGX360KF40C3N

    EP4SGX360KF40C3N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM58625BB1KF12G

    BCM58625BB1KF12G

    BCM58625BB1KF12G is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7K160T-3FFG676E

    XC7K160T-3FFG676E

    XC7K160T-3FFG676E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM53212MIPBG

    BCM53212MIPBG

    BCM53212MIPBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EPCQ128ASI16N

    EPCQ128ASI16N

    EPCQ128ASI16N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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