EM526 High Speed PCB Manufacturers

That has a positive and progressive attitude to customer's fascination, our enterprise constantly improves our merchandise high quality to meet the demands of customers and further focuses on safety, reliability, environmental requirements, and innovation of EM526 High Speed PCB,18 layer large size PCB,EM888 High Speed PCB,Oversized size PCB,TUC High Speed PCB, Through our hard work, we have always been on the forefront of clean technology product innovation. We are a green partner you can rely on. Contact us today for more information!
EM526 High Speed PCB, With high quality, reasonable price, on-time delivery and customized & personalized services to help customers achieve their goals successfully, our company has got praise in both domestic and foreign markets. Buyers are welcome to contact us.

Hot Products

  • XC6SLX100-3FGG484I

    XC6SLX100-3FGG484I

    XC6SLX100-3FGG484I is an advanced field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 98,304 logic cells, 4.9 Mb of distributed RAM, 240 Digital Signal Processing (DSP) slices, and 8 clock management tiles. It requires a power supply of 1.2V to 1.5V and supports various I/O standards such as LVCMOS, LVDS, and PCI Express.
  • HI-35930PQIF

    HI-35930PQIF

    ​HI-35930PQIF is a CMOS integrated circuit produced by Holt Integrated Circuit Company, designed specifically for interfacing microcontrollers that support Serial Peripheral Interface (SPI) with ARINC 429 serial bus interface
  • XC7A25T-1CSG325C

    XC7A25T-1CSG325C

    XC7A25T-1CSG325C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM88823CA1KFSBG

    BCM88823CA1KFSBG

    BCM88823CA1KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S1400AN-4FGG676C

    XC3S1400AN-4FGG676C

    XC3S1400AN-4FGG676C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM63138SEKFSBG

    BCM63138SEKFSBG

    The BCM63138SEKFSBG is a high-performance multimedia gateway SoC (System-on-Chip) from Broadcom, a leading global semiconductor company specializing in wired and wireless communications technologies. This SoC is designed to meet the growing demands of multi-service and multimedia home gateway applications, providing a robust and scalable solution for telecom service providers.

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