8layers 3Step HDI PCB Manufacturers

We've been also focusing on improving upon the stuff management and QC program to make sure that we could hold fantastic gain in the fiercely-competitive enterprise for 8layers 3Step HDI PCB,8layers 2Step HDI PCB,10layers 3Step HDI PCB,HDI PCB, Honesty is our principle, professional operation is our work, service is our goal, and customers' satisfaction is our future!
8layers 3Step HDI PCB, Only for accomplishing the good-quality product to meet customer's demand, all of our products have been strictly inspected before shipment. We always think about the question on the side of the customers, because you win, we win!

Hot Products

  • XC6SLX16-2FTG256I

    XC6SLX16-2FTG256I

    XC6SLX16-2FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC4VLX40-10FF668C

    XC4VLX40-10FF668C

    XC4VLX40-10FF668C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC2S300E-7FGG456C

    XC2S300E-7FGG456C

    ​XC2S300E-7FGG456C is a product in the Spartan IIE FPGA series produced by Xilinx. It belongs to Field Programmable Gate Arrays (FPGAs), which have high flexibility and configurability, and are suitable for various digital circuit designs. The specific specifications and functions of XC2S300E-7FGG456C may include but are not limited to the following:
  • PM-DB2776

    PM-DB2776

    PM-DB2776 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S1400AN-4FGG676C

    XC3S1400AN-4FGG676C

    XC3S1400AN-4FGG676C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Medical PCBA

    Medical PCBA

    HONTEC has 30 medical PCBA production lines such as Panasonic and Yamaha, Germany ersa selective wave soldering, solder paste detection 3D SPI, AOI, X-ray, BGA repair table and other equipment.

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