5SGXMA3H2F35I2N Manufacturers

Adhering into the theory of "quality, services, efficiency and growth", now we have gained trusts and praises from domestic and international shopper for 5SGXMA3H2F35I2N, Our really specialized process eliminates the component failure and offers our shoppers unvarying top quality, allowing us to control cost, plan capacity and maintain consistent on time delivery.
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Hot Products

  • STM32F042C6T6

    STM32F042C6T6

    STM32F042C6T6 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7S50-2CSGA324I

    XC7S50-2CSGA324I

    ​XC7S50-2CSGA324I is an FPGA (Field Programmable Gate Array) launched by AMD/Xilinx, with the following features and specifications: Packaging form: CSPBGA-324 packaging is adopted, which is a surface mount packaging suitable for high-density integrated circuits
  • HI-1565PSI

    HI-1565PSI

    HI-1565PSI is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC5VSX95T-1FFG1136I

    XC5VSX95T-1FFG1136I

    ​XC5VSX95T-1FFG1136I is a high-performance FPGA (Field Programmable Gate Array) chip produced by Xilinx, belonging to the Virtex-5 SXT series
  • XCVU080-2FFVB1760E

    XCVU080-2FFVB1760E

    ​XCVU080-2FFVB1760E is an FPGA (Field Programmable Gate Array) product produced by Xilinx, belonging to the Kintex UltraScale series. This FPGA has the following features and specifications:
  • HDI PCB

    HDI PCB

    HDI PCB is the abbreviation of "high density interconnector", which is a kind of printed circuit board (PCB) production. It is a kind of circuit board with high line distribution density using micro blind buried hole technology.

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