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The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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  • XC7A75T-1CSG324I

    XC7A75T-1CSG324I

    ​XC7A75T-1CSG324I is a high-performance, step-down DC-DC power module developed by Analog Devices, a leading semiconductor technology company. This device features a wide input voltage range of 6V to 36V and a maximum output current of 5A.
  • XC6SLX75-2FGG484C

    XC6SLX75-2FGG484C

    ​XC6SLX75-2FGG484C The platform's components support up to 150K logic density, 4.8Mb memory, integrated storage controllers, and easy-to-use high-performance system IPs (such as DSP modules), while adopting innovative open standard based configurations.
  • XC5VLX50T-1FFG665I

    XC5VLX50T-1FFG665I

    XC5VLX50T-1FFG665I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • LTM4622IY#PBF

    LTM4622IY#PBF

    LTM4622IY#PBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2AGX190EF29I5G

    EP2AGX190EF29I5G

    ​The EP2AGX190EF29I5G Arria ® II GX EP2AGX190EF29I5G FPGA provides stronger functionality for applications based on 6G transceivers.
  • XCKU040-2FBVA676E

    XCKU040-2FBVA676E

    ​XCKU040-2FBVA676E is a Kintex based ® The UltraScale architecture FPGA (Field Programmable Gate Array) chip is produced by AMD (formerly Xilinx). It has high performance and flexible programmability, suitable for a wide range of application fields such as data centers
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    Printed circuit board (PCB), also known as printed circuit board. It is not only the carrier of electronic components in electronic products, but also the provider of circuit connection of electronic components. The traditional circuit board uses the method of printing etchant to make the circuit and drawing, so it is called printed circuit board or printed circuit board.

  • DHI board surface treatment technology carbon series direct plating

    This article will review the development history of carbon series direct plating technology, including new breakthroughs in equipment technology, and how to apply it to today's flagship mobile phones with extremely fine line width and line spacing.

  • HDI board market supply and demand analysis

    The continuous growth of mobile phone production is driving the demand for HDI boards. China plays an important role in the world's mobile phone manufacturing industry. Since Motorola fully adopted HDI boards to manufacture mobile phones in 2002, more than 90% of mobile phone motherboards have adopted HDI boards. A research report released by market research company In-Stat in 2006 predicted that in the next five years, global mobile phone production will continue to grow at a rate of about 15%. By 2011, global mobile phone sales will reach 2 billion units.

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    Components: products that do not change the molecular composition of raw materials during processing can be called components.

  • Han's Laser's 2016 operating income was 6.959 billion yuan, a year-on-year increase of 24.55%

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  • Current status of semiconductor chips in China

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