5CGXFC5C6F27I7N Manufacturers

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Hot Products

  • 10AX066K3F40I2LG

    10AX066K3F40I2LG

    10AX066K3F40I2LG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC6SLX16-3CSG225I

    XC6SLX16-3CSG225I

    XC6SLX16-3CSG225I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5CGXFC4F6M11C7N

    5CGXFC4F6M11C7N

    5CGXFC4F6M11C7N is an FPGA (Field Programmable Gate Array) product produced by Altera Corporation. The following are the detailed specifications of the product:
  • 10M16SAU169C8G

    10M16SAU169C8G

    10M16SAU169C8G is a high-performance FPGA chip produced by Intel (formerly Altera). This chip is manufactured using a 10nm process and has 1696 logic units and 1 million lookup tables. It has low power consumption and is suitable for applications that require high power consumption
  • XCZU2CG-1SFVC784I

    XCZU2CG-1SFVC784I

    XCZU2CG-1SFVC784I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU7P-2FLVA2104I

    XCVU7P-2FLVA2104I

    The XCVU7P-2FLVA2104I device provides the highest performance and integrated functionality on 14nm/16nm FinFET nodes. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements. It also provides a virtual single-chip design environment to provide registered routing lines between chips to achieve operation above 600MHz and provide richer and more flexible clocks.

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