5AGXMA7G4F31C5G Manufacturers

​EP4CE22F17I7N Cyclone IV equipment is available in commercial, industrial, extended industrial, and automotive grades. Cyclone IV E devices provide -6 (fastest), -7, -8, -8L, and -9L speed levels for commercial equipment, -8L speed level for industrial equipment, and -7 speed level for expanding industrial and automotive equipment. The Cyclone IV GX equipment provides -6 (fastest), -7, and -8 speed levels for commercial equipment and -7 speed levels for industrial equipment.

XCVU13P-2FHGA2104I is a scalable and reconfigurable acceleration platform suitable for optimizing complex workloads. It has a large amount of raw computing power and I/O flexibility, suitable for computationally intensive workloads in data center applications

XCVU19P-2FSVB3824I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

BCM6710A1KFFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

10AS048H3F34E2SG is an FPGA chip with excellent performance and broad application prospects. It features high performance, low power consumption, flexibility, and reliability, making it suitable for application scenarios that require these characteristics

​XCKU15P-3FFVE1517E Kintex® UltraScale+ ™ FPGA provides high cost-effectiveness in FinFET nodes, offering an economical and efficient solution for applications that require high-end functionality, including 33Gb/s transceivers and 100G connectivity cores.