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10M08DCU324I7G Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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  • BCM82380BKFSBG

    BCM82380BKFSBG

    BCM82380BKFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU28DR-2FFVD1156I

    XCZU28DR-2FFVD1156I

    XCZU28DR-2FFVD1156I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Ceramic PCB

    Ceramic PCB

    Ceramic PCB substrate is a 96% aluminum oxide ceramic double-sided copper clad substrate, which is mainly used in high-power module power supplies, high-power LED lighting substrates, solar photovoltaic substrates, high-power microwave power devices, which have high thermal conductivity, high pressure resistance, high temperature resistance, solderability resistance.
  • TG250 PCB

    TG250 PCB

    Tg250 PCB is made of polyimide material. It can withstand high temperature for a long time and does not deform at 230 degrees. It is suitable for high temperature equipment, and its price is slightly higher than that of ordinary FR4
  • EP2S30F484I4N

    EP2S30F484I4N

    EP2S30F484I4N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5AGTMC3D3F31I3G

    5AGTMC3D3F31I3G

    5AGTMC3D3F31I3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
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  • Today, we will talk about the knowledge related to chips, hoping to provide some help for everyone to understand chips!

    1. Introduction to chips What is a chip? A chip is an integrated circuit that can be compared to the brain of an electronic device. The components on a chip can perform various tasks, such as processing information, storing data, performing calculations, and controlling operations. Why is it called a chip? "Core" represents the core and center, and "chip" represents a thin piece or fragment. A chip is a thin piece made of semiconductor materials, which, as the core part of the entire circuit system, integrates key circuit structures.

  • C919 Chinese people just made a shell? Let's see what the insiders say

    The successful first flight of the C919 large passenger plane made many people excited. However, some different voices also appeared on the Internet: saying that many parts of this aircraft are imported goods, and some even said that the Chinese C919 just made a shell.

  • High Frequency Printed Circuit Board

    Nowadays, high frequency electronics are of great concern, especially in remote systems. With the rapid development of satellite communication, data items are developing towards fast and high frequency.

  • Advantages and disadvantages of Flex-Rigid PCB

    The flexible circuit board is rolled with copper and similar materials, and the main goal is to provide sufficient flexibility and bending resistance. On the other hand, flexible rigid PCBs are constructed using a combination of two technologies and have flexible and rigid areas.

  • 5G base stations require high-frequency and high-speed circuits, PCB has become a popular product line in the 5G era

    PCB (Printed Circuit Board) is an industry with a relatively low technical threshold. However, 5G communication has the characteristics of high frequency and high speed. Therefore, 5G PCB requires higher technology and the industry threshold is raised; at the same time, the output value is also pulled up.

  • PCB wiring

    Wiring is the most important process in the entire PCB design.

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