10M02SCU169I7G Manufacturers

Assume full accountability to fulfill all demands of our purchasers; attain continual advancements by marketing the advancement of our clientele; grow to be the final permanent cooperative partner of purchasers and maximize the interests of purchasers for 10M02SCU169I7G, Because we stay with this line about 10 years. We got most effective suppliers support on excellent and cost. And we had weed out suppliers with poor high quality. Now several OEM factories cooperated with us too.
10M02SCU169I7G, Adhering to the principle of "Enterprising and Truth-Seeking, Preciseness and Unity", with technology as the core, our company continues to innovate, dedicated to providing you with the highest cost-effective solutions and meticulous after-sales service. We firmly believe that: we're outstanding as we have been specialized.

Hot Products

  • XA7Z020-1CLG484Q

    XA7Z020-1CLG484Q

    XA7Z020-1CLG484Q is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5CGXFC7D6F27C7N

    5CGXFC7D6F27C7N

    ​5CGXFC7D6F27C7N is a Cyclone V GX series FPGA chip produced by Intel (formerly Altera). The chip is packaged in FBGA-672 and has 149500 logic units and 336 I/O ports, supporting system programmability and reprogramming. Its working power supply voltage range is 1.07V to 1.13V
  • XCKU035-2FFVA1156I

    XCKU035-2FFVA1156I

    XCKU035-2FFVA1156I ​Xilinx XCKU035-1FFVA1156I Kintex® UltraScale ™ Field programmable gate arrays can achieve extremely high signal processing bandwidth in mid-range devices and next-generation transceivers. FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnect system
  • XC3S400-5TQ144C

    XC3S400-5TQ144C

    XC3S400-5TQ144C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU13P-2FLGA2577E

    XCVU13P-2FLGA2577E

    ​XCVU13P-2FLGA2577E Virtex™ UltraScale+ ™ The device provides the highest performance and integrated functionality on the 14nm/16nm FinFET node. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements
  • XC7A15T-1FTG256C

    XC7A15T-1FTG256C

    XC7A15T-1FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

Send Inquiry