10M02SCU169I7G Manufacturers

Assume full accountability to fulfill all demands of our purchasers; attain continual advancements by marketing the advancement of our clientele; grow to be the final permanent cooperative partner of purchasers and maximize the interests of purchasers for 10M02SCU169I7G, Because we stay with this line about 10 years. We got most effective suppliers support on excellent and cost. And we had weed out suppliers with poor high quality. Now several OEM factories cooperated with us too.
10M02SCU169I7G, Adhering to the principle of "Enterprising and Truth-Seeking, Preciseness and Unity", with technology as the core, our company continues to innovate, dedicated to providing you with the highest cost-effective solutions and meticulous after-sales service. We firmly believe that: we're outstanding as we have been specialized.

Hot Products

  • 10 Layer 4Step HDI PCB

    10 Layer 4Step HDI PCB

    HDI is the English abbreviation of High Density Interconnector, high-density interconnect (HDI) manufacturing printed circuit board. The printed circuit board is a structural element formed by insulating material supplemented by conductor wiring. The following is about 10 Layer 4Step HDI PCB related, I hope to help you better understand 10 Layer 4Step HDI PCB.
  • XCKU040-1FFVA1156C

    XCKU040-1FFVA1156C

    ​XCKU040-1FFVA1156C is a high-performance, low-power FPGA (Field Programmable Gate Array) chip that demonstrates strong application potential and is widely used in various fields such as industrial automation, smart homes, medical equipment, and transportation. With its high performance, low power consumption, and programmability, this chip plays an irreplaceable role in multiple fields.
  • EPM3064ATI100-10N

    EPM3064ATI100-10N

    EPM3064ATI100-10N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC2S150E-6FGG456C

    XC2S150E-6FGG456C

    XC2S150E-6FGG456C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • DS3231MZ+TRL

    DS3231MZ+TRL

    DS3231MZ+TRL is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU190-2FLGB2104E

    XCVU190-2FLGB2104E

    XCVU190-2FLGB2104E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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