10AX048H3F34I2LG Manufacturers

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Hot Products

  • XC7VX690T-3FFG1926E

    XC7VX690T-3FFG1926E

    XC7VX690T-3FFG1926E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM56041A0KFSBLG

    BCM56041A0KFSBLG

    BCM56041A0KFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • HI-8586CRM

    HI-8586CRM

    HI-8586CRM is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC5VLX85T-1FFG1136C

    XC5VLX85T-1FFG1136C

    XC5VLX85T-1FFG1136C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU13P-3FHGA2104E

    XCVU13P-3FHGA2104E

    XCVU13P-3FHGA2104E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 4 Layer High Precision HDI PCB

    4 Layer High Precision HDI PCB

    This kind of PCB with a whole row of semi-metallized holes on the side of the board is characterized by a relatively small aperture. It is mostly used on the carrier board as a daughter board of the mother board. The feet are welded together.The following is about 4 Layer High Precision HDI PCB related, I hope to help you better understand 4 Layer High Precision HDI PCB.

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