10AX027H3F35E2SG Manufacturers

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Hot Products

  • XCVU11P-3FLGB2104E

    XCVU11P-3FLGB2104E

    ​XCVU11P-3FLGB2104E Virtex™ UltraScale+ ™ FPGA devices provide the highest performance and integrated functionality on 14nm/16nm FinFET nodes.
  • XC6SLX150-3FGG676I

    XC6SLX150-3FGG676I

    ​XC6SLX150-3FGG676I Packaging BGA integrated circuit chips, IC electronic components, inquiry and order placement
  • BCM65411B1IFSBG

    BCM65411B1IFSBG

    BCM65411B1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU43DR-L2FFVE1156I

    XCZU43DR-L2FFVE1156I

    XCZU43DR-L2FFVE1156I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 6 layers ELIC HDI PCB

    6 layers ELIC HDI PCB

    Any Layer Inner Via Hole,The arbitrary interconnection between layers can meet the wiring connection requirements of high-density HDI boards. Through the setting of thermally conductive silicone sheets, the circuit board has good heat dissipation and shock resistance.The following is about 6 layers ELIC HDI PCB, I hope to help you better understand 6 layers ELIC HDI PCB.
  • XC7S15-2CPGA196I

    XC7S15-2CPGA196I

    ​XC7S15-2CPGA196I Spartan ® -7 Field Programmable Gate Array adopts 28 nanometer technology and is equipped with MicroBlaze ™ Soft processor, running over 200 DMIPs, supporting 800Mb/s DDR3

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