XILIUX Manufacturers

Getting buyer gratification is our company's purpose endlessly. We will make good attempts to produce new and top-quality products, meet up with your specific requirements and provide you with pre-sale, on-sale and after-sale expert services for XILIUX,XQR5VFX130-1CN1752B,FPGA-1752, In case you have any comments about our corporation or products, you should experience no cost to call us, your coming mail will be remarkably appreciated.
XILIUX, Our company is working by the operation principle of "integrity-based, cooperation created, people oriented, win-win cooperation". We hope we can have a friendly relationship with businessman from all over the world.

Hot Products

XC6SLX16-2CPG196I
XC6SLX16-2CPG196I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
5SGXEA7N2F45I3N
The 5SGXEA7N2F45I3N is a Field-Programmable Gate Array (FPGA) device manufactured by Intel (formerly Altera Corporation), belonging to the Stratix® V GX series. This device offers a combination of advanced features and capabilities
XCF32PVOG48C
XCF32PVOG48C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
EP2AGX65DF29I3G
EP2AGX65DF29I3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
High Thermal Conductivity PCB
The high thermal conductivity FR4 circuit board usually guides the thermal coefficient to be greater than or equal to 1.2, while the thermal conductivity of ST115D reaches 1.5, the performance is good, and the price is moderate. The following is about High Thermal Conductivity PCB related, I hope to help you better understand High Thermal Conductivity PCB.
BCM88485CB1IFSBG
BCM88485CB1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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When designing a four-layer PCB circuit board, how is the stack-up generally designed?
When designing a four-layer PCB circuit board, how is the stack-up generally designed?
What is the C chip
IC chip (integrated circuit) is an integrated circuit formed by putting a large number of microelectronic components (transistors, resistors, capacitors, diodes, etc.) on a plastic base to make a chip. At present, almost all chips can be called IC chips.
China and the US "Hundred Days Plan" exposes How will the manufacturing industry be affected?
If you want to effectively reduce the US trade deficit with China, the electronics industry seems to be the most obvious choice.
Development history of electronic components
The development history of electronic components is actually a condensed history of electronic development. Electronic technology is an emerging technology developed at the end of the 19th century and the beginning of the 20th century. It has developed most rapidly and widely used in the 20th century, and has become an important symbol of the development of modern science and technology.
Analysis of the Current Development Status and Prospects of Semiconductor Application Industry in China
In the 1980s, China began to enter the semiconductor industry. In the early days, semiconductor technology mainly relied on imports, while China mainly engaged in simple assembly and testing work. At that time, major enterprises such as Shanghai Hongli and East China Semiconductor had a significant gap between their product technology level and the international advanced level, but it laid the foundation for the Chinese semiconductor industry
Causes and solutions of blistering in multilayer circuit boards
Reasons for blistering of multilayer circuit board

XILIUX Manufacturers

Related Products

Hot Products

XC6SLX16-2CPG196I

5SGXEA7N2F45I3N

XCF32PVOG48C

EP2AGX65DF29I3G

High Thermal Conductivity PCB

BCM88485CB1IFSBG

When designing a four-layer PCB circuit board, how is the stack-up generally designed?

What is the C chip

China and the US "Hundred Days Plan" exposes How will the manufacturing industry be affected?

Development history of electronic components

Analysis of the Current Development Status and Prospects of Semiconductor Application Industry in China

Causes and solutions of blistering in multilayer circuit boards

Miranda 2021-10-20 11:09:47

Penny 2022-08-25 01:38:47

Rosemary 2022-07-26 05:56:21

Ruby 2023-02-10 20:09:52

Kevin Ellyson 2021-10-08 15:30:05

Nelly 2021-07-03 23:34:38

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An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.