XCZU9EG-2FFVB1156I Manufacturers

While in the past few years, our organization absorbed and digested sophisticated technologies both equally at home and abroad. Meanwhile, our corporation staffs a group of experts devoted to your advancement of XCZU9EG-2FFVB1156I, As an expert specialized with this field, we have been committed to solving any problem of significant temperature protection for users.
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Hot Products

  • XCVU095-1FFVB2104I

    XCVU095-1FFVB2104I

    ​XCVU095-1FFVB2104I is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, belonging to the Kintex UltraScale series. This chip adopts advanced 20nm process technology, providing maximum performance and integration, especially suitable for applications in high-performance computing, network communication, data centers, and AI fields. Here are some detailed introductions about XCVU095-1FFVB2104I
  • XC6VLX550T-2FFG1760I

    XC6VLX550T-2FFG1760I

    ​XC6VLX550T-2FFG1760I is a Virtex-6 series FPGA chip produced by Xilinx. The chip is packaged in FBGA-1760 and has 549888 logic units and 1200 user input/output ports. Its working power supply voltage range is 0.9V to 1.05V, and the working temperature range is -40 ° C to 100 ° C
  • Buried capacitance PCB

    Buried capacitance PCB

    24-Layer Buried capacitance PCB has a process called burying resistance, which is to put chip resistors and chip capacitors into the inner layer of the PCB board. These chip resistors and capacitors are generally very small, such as 0201, or even smaller 01005. The PCB board produced in this way is the same as a normal PCB board, but a lot of resistors and capacitors are placed in it. For the top layer, the bottom layer saves a lot of space for component placement. The following is about 24 Layer Buried capacitance PCB related, I hope to help you better understand 24 Layer Buried capacitance PCB.
  • XC7A35T-2CSG325I

    XC7A35T-2CSG325I

    XC7A35T-2CSG325I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7K410T-L2FBG676I

    XC7K410T-L2FBG676I

    XC7K410T-L2FBG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • HI-35930PQTF

    HI-35930PQTF

    HI-35930PQTF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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