Products
Home > Products > XCZU9EG-2FFVB1156I

XCZU9EG-2FFVB1156I Manufacturers

While in the past few years, our organization absorbed and digested sophisticated technologies both equally at home and abroad. Meanwhile, our corporation staffs a group of experts devoted to your advancement of XCZU9EG-2FFVB1156I, As an expert specialized with this field, we have been committed to solving any problem of significant temperature protection for users.
XCZU9EG-2FFVB1156I, With high quality, reasonable price, on-time delivery and customized & personalized services to help customers achieve their goals successfully, our company has got praise in both domestic and foreign markets. Buyers are welcome to contact us.

Related Products

Hot Products

  • XCZU43DR-L2FFVE1156I

    XCZU43DR-L2FFVE1156I

    XCZU43DR-L2FFVE1156I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • AD9528BCPZ

    AD9528BCPZ

    ​AD9528BCPZ produces six outputs with a maximum frequency of 1.25 GHz (output 0 to output 3, output 12, and output 13), as well as eight outputs with a maximum frequency of 1 GHz. Each output can be configured to output directly from PLL1, PLL2,
  • XCVU37P-3FSVH2892E

    XCVU37P-3FSVH2892E

    XCVU37P-3FSVH2892E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC3S200-4TQG144I

    XC3S200-4TQG144I

    XC3S200-4TQG144I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5AGTMD3G3F31I3G

    5AGTMD3G3F31I3G

    5AGTMD3G3F31I3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCZU19EG-3FFVB1517E

    XCZU19EG-3FFVB1517E

    ​XCZU19EG-3FFVB1517E is an embedded system on chip (SoC) produced by Xilinx. This product belongs to the Zynq UltraScale+series and has the following key features and functions:
  • Related Blog
  • Reviews

  • Dongbao Circuit Board Industrial Park to build a park with an annual output value of 10 billion yuan

    According to the relevant person in charge of the management committee of Dongbao Industrial Park, the park has officially entered 6 companies, including Meidian, Weide, and Jiuxiang have been put into production, Jinrun Dingsheng is debugging equipment, Hongxin Huayin, Yongchuangxin are under construction Plant.

  • Installation mode of components on PCB printed circuit board

    Our common computer boards and cards are basically epoxy resin glass cloth based double-sided printed circuit boards. One side is the plug-in components, and the other side is the welding surface of the component feet. It can be seen that the welding points are very regular

  • Heavy copper PCB manufacturing

    Just like the standard PCB manufacturing method, heavy copper PCB manufacturing requires more delicate processing.

  • What is an HDI (High Density Interconnect) PCB?

    High Density Interconnection (HDI) PCB is a kind of (technology) for the production of printed circuit boards. It is a circuit board with relatively high circuit distribution density using micro blind via and buried via technology.

  • Development history of electronic components

    The development history of electronic components is actually a condensed history of electronic development. Electronic technology is an emerging technology developed at the end of the 19th century and the beginning of the 20th century. It has developed most rapidly and widely used in the 20th century, and has become an important symbol of the development of modern science and technology.

  • What are the advantages of PCB components

    From common electronic systems to some complex mechanical and electrical engineering systems, they are composed of a large number of parts of different specifications and types. Nowadays, with the development of PCB related technology, the application value of these parts has also been recognized by more fields. Manufacturers specializing in the design, research and development of these parts and technical process research have also entered the cooperation scope of many large brand enterprises. Next, analyze the three outstanding advantages of PCB:

Send Inquiry