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The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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  • 8MM Thick Megtron4 PCB

    8MM Thick Megtron4 PCB

    The success of a product depends on its internal quality. Second, it takes into account the overall beauty. Both are perfect to be considered successful. On a PCB board, the layout of the components needs to be balanced, dense and orderly, not top-heavy or heavy. The following is about 36 Layer 8MM Thick Megtron4 PCB related, I hope to help you better understand 36 Layer 8MM Thick Megtron4 PCB.
  • XCZU6EG-2FFVB1156I

    XCZU6EG-2FFVB1156I

    XCZU6EG-2FFVB1156I based on Xilinx ® UltraScale MPSoC architecture. This product integrates feature rich 64 bit quad core or dual core Arm ® Cortex-A53 and dual core Arm Cortex-R5F processing system (based on Xilinx) ® UltraScale MPSoC architecture).
  • XC7VX485T-2FFG1761I

    XC7VX485T-2FFG1761I

    XC7VX485T-2FFG1761I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC6SLX9-2CPG196I

    XC6SLX9-2CPG196I

    ​XC6SLX9-2CPG196I is a high-performance FPGA chip produced by Xilinx. This chip has the following characteristics and specifications:
  • XC3S1000-4FGG456I

    XC3S1000-4FGG456I

    XC3S1000-4FGG456I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5SGXMA3H2F35C2LN

    5SGXMA3H2F35C2LN

    ​5SGXMA3H2F35C2LN is an FPGA (Field Programmable Gate Array) product produced by Intel Corporation, belonging to the Stratix V GX series. This FPGA has 957 logic units (LABs) and 432 input/output (I/O) terminals, making it suitable for applications that require highly programmable logic solutions.
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  • Dongbao Circuit Board Industrial Park to build a park with an annual output value of 10 billion yuan

    According to the relevant person in charge of the management committee of Dongbao Industrial Park, the park has officially entered 6 companies, including Meidian, Weide, and Jiuxiang have been put into production, Jinrun Dingsheng is debugging equipment, Hongxin Huayin, Yongchuangxin are under construction Plant.

  • Current status of semiconductor chips in China

    What is the status of Chinese chips On June 9, 2021, at the world semiconductor conference, Wu Hanming, an academician of the Chinese Academy of engineering, pointed out the current situation of China's chips: China still needs 8 SMIC's if it wants to complete the localization and replacement of chips. In short, now China needs 8 SMIC's

  • How to fix the integrated circuit problem

    The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.

  • According to the number of microelectronic devices integrated on a chip, integrated circuits can be divided into the following categories:

    According to the number of microelectronic devices integrated on a chip, integrated circuits can be divided into the following categories:

  • Precautions for the use of high-speed board plates you must know

    With the rapid development of electronic design and communication fields and the application of cloud computing, products have higher and higher requirements for data volume, and data transmission rates are getting faster and faster. At the same time, the performance of high-speed plates that carry data transmission is also required to be higher and higher.So what should be paid attention to when using high-speed plates?

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