XCZU7EG-1FBVB900I Manufacturers

To continually improve the management procedure by virtue in the rule of "sincerely, great religion and good quality are the base of company development", we commonly absorb the essence of associated products and solutions internationally, and regularly build new solutions to meet the calls for of consumers for XCZU7EG-1FBVB900I, We are really proud of your great name from our shoppers for our products' reputable quality.
XCZU7EG-1FBVB900I, We've got constantly insisted on the evolution of solutions, spent good funds and human resource in technological upgrading, and facilitate production improvement, meeting the wants of prospects from all countries and regions.

Hot Products

  • EP3SL150F1152C4N

    EP3SL150F1152C4N

    EP3SL150F1152C4N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC6SLX45-3CSG324I

    XC6SLX45-3CSG324I

    ​The XC6SLX45-3CSG324I platform devices support up to 150K logic density, 4.8Mb memory, integrated storage controllers, and easy-to-use high-performance system IPs (such as DSP modules), while adopting innovative open standard based configurations.
  • Microstrip PCB

    Microstrip PCB

    Microstrip PCB refers to high-frequency PCB. For special circuit board with high electromagnetic frequency, generally speaking, high frequency board can be defined as frequency above 1GHz. The high frequency board comprises a core plate with a hollow groove and a copper clad plate bonded to the upper surface and the lower surface of the core board through flow glue. The edges of the upper opening and the lower opening of the hollow groove are provided with ribs.
  • XC5VLX85-1FF676C

    XC5VLX85-1FF676C

    XC5VLX85-1FF676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XA3S200A-4FTG256Q

    XA3S200A-4FTG256Q

    XA3S200A-4FTG256Q is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU085-2FLVA1517E

    XCKU085-2FLVA1517E

    ​XCKU085-2FLVA1517E has a power option that achieves the best balance between required system performance and low power envelope. XCKU085-2FLVA1517E is an ideal choice for packet processing and DSP intensive functions, suitable for various applications ranging from wireless MIMO technology to Nx100G networks and data centers.

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