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To continually improve the management procedure by virtue in the rule of "sincerely, great religion and good quality are the base of company development", we commonly absorb the essence of associated products and solutions internationally, and regularly build new solutions to meet the calls for of consumers for XCZU7EG-1FBVB900I, We are really proud of your great name from our shoppers for our products' reputable quality.
XCZU7EG-1FBVB900I, We've got constantly insisted on the evolution of solutions, spent good funds and human resource in technological upgrading, and facilitate production improvement, meeting the wants of prospects from all countries and regions.

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    10M25DAF484C8G

    ​10M25DAF484C8G is an FPGA (Field Programmable Gate Array) product produced by Altera (now acquired by Intel). This FPGA adopts FBGA484 package and has the following key features: Packaging form: FBGA484 packaging is used, which is a surface mount technology suitable for high-density integrated circuits. Working temperature range: The minimum working temperature is -40 ° C, and the maximum working temperature is 130 ° C, suitable for applications under various environmental conditions.
  • BCM84544WA1IFSBG

    BCM84544WA1IFSBG

    BCM84544WA1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7A200T-2SBG484I

    XC7A200T-2SBG484I

    XC7A200T-2SBG484I is a high-performance FPGA chip launched by Xilinx, belonging to the Artix series. This chip adopts advanced 28 nanometer process technology and has up to 200000 logic units, which can meet various complex digital circuit design requirements. The XC7A200T-2SBG484I chip has the following characteristics and advantages:
  • XC7VX690T-L2FFG1930E

    XC7VX690T-L2FFG1930E

    XC7VX690T-L2FFG1930E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU125-2FLVB1760I

    XCVU125-2FLVB1760I

    XCVU125-2FLVB1760I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM95719A1904AC

    BCM95719A1904AC

    BCM95719A1904AC is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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  • The characteristics of rigid-flex board

    Rigid-flex board is a combination of flexible board and hard board. It is a circuit board formed by combining a thin layered flexible bottom layer with a rigid bottom layer, and then laminating it into a single component.The flexible board is used to replace the cable assembly to complete the highly reliable connection and transmission of power and electrical signals.The product can work stably and reliably for a long time under harsh environments such as high and low temperature, high humidity, vibration, salt spray, and low air pressure. At present, Jonhon Optronic has provided rigid and flexible printed board solutions for aviation, aerospace, ships, weapons and other fields.

  • Thermal stress treatment quality of heavy copper PCB

    When designing a circuit, factors such as thermal stress are very important, and engineers should eliminate thermal stress as much as possible. Over time, PCB manufacturing processes have continued to evolve, and various PCB technologies have been invented, such as aluminum PCBs, which can handle thermal stress. It is in the interests of heavy copper PCB designers to minimize the power budget while maintaining the circuit. Performance and environmentally friendly design with heat dissipation performance.

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    ​An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

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    Designing a PCB (Printed Circuit Board) for high-frequency applications requires careful consideration of various factors to ensure signal integrity, minimize losses, and mitigate electromagnetic interference. Here are some key steps and considerations:

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    Our common computer boards and cards are basically epoxy resin glass cloth based double-sided printed circuit boards. One side is the plug-in components, and the other side is the welding surface of the component feet. It can be seen that the welding points are very regular.

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    The semiconductor industry is a high-tech industry that involves the research and development, manufacturing, and application of semiconductor materials. Semiconductors are a special type of material with conductive properties that lie between conductors and insulators. Semiconductor materials achieve the functionality of electronic devices by controlling the flow of current.

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