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The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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  • HI-3585PQT

    HI-3585PQT

    The HI-3585PQT is a silicon gate CMOS device designed to interface a Serial Peripheral Interface (SPI) enabled microcontroller to the ARINC 429 serial bus. This device serves as a terminal IC that allows for efficient communication between microcontrollers and the ARINC 429 protocol, commonly used in avionics and other industrial applications
  • XC3S200A-4FTG256C

    XC3S200A-4FTG256C

    XC3S200A-4FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S400-4PQG208I

    XC3S400-4PQG208I

    XC3S400-4PQG208I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • TU-943N High-speed PCB

    TU-943N High-speed PCB

    TU-943N High-speed PCB -- the development of electronic technology is changing with each passing day. This change mainly comes from the progress of chip technology. With the wide application of deep submicron technology, semiconductor technology is becoming increasingly physical limit. VLSI has become the mainstream of chip design and application.
  • XC6SLX25T-N3CSG324I

    XC6SLX25T-N3CSG324I

    ​The XC6SLX25T-N3CSG324I Spartan-6 FPGA has up to six CMTs, each consisting of two DCMs and one PLL, and can be used alone or in a cascade. The Spartan-6 FPGA extends the density of 3840 to 147443 logic units, with only half the power consumption of the previous Spartan series, and has faster and more comprehensive connectivity. The Spartan-6 series adopts mature 45 nanometer low-power copper process technology, achieving the best balance of cost, power consumption, and performance, providing a new and more efficient dual register 6-input lookup table logic and rich built-in system level blocks.
  • Buried resistor PCB

    Buried resistor PCB

    Buried resistor PCB--The backplane has always been a specialized product in the PCB manufacturing industry. The backplane is thicker and heavier than conventional PCB boards, and accordingly its heat capacity is also larger.The following is about Double sided Pressfit Backdrill Board related, I hope to help you better understand Double sided Pressfit Backdrill Board.
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  • Han's Laser's 2016 operating income was 6.959 billion yuan, a year-on-year increase of 24.55%

    On April 24, Han's Laser released its 2016 annual report and a quarterly report for 2017. During the reporting period, it achieved operating income of 6.959 billion yuan, a year-on-year increase of 24.55%, and realized net profit of 754 million yuan. In 17Q1, profit increased by 31.50%, and the profit growth rate in the first half of the year is expected to be 60%-90%.

  • Non-Apple HDI Big Release

    According to market reports, Huawei and other non-Apple flagship HDI expanded release orders, which will add momentum to the PCB factory's off-season operations in the first quarter of this year.

  • Classification of electronic components

    Components: products that do not change the molecular composition of raw materials during processing can be called components.

  • Application fields of semiconductors

    The photovoltaic effect of semiconductor material is the basic principle of solar cell operation. At present, the photovoltaic application of semiconductor materials has become a hot topic and is currently the fastest growing and best developing clean energy market in the world. The main production material of solar cells is semiconductor materials,

  • Advantages and disadvantages of multilayer boards

    Multilayer boards were invented in 1961. Its production method is generally to make the inner layer graphics first, and then use the printing and etching method to make a single-sided or double-sided substrate, and incorporate it into the designated interlayer, and then heat, press and bond it. As for the subsequent drilling, It is the same as the plated through-hole method of the double-sided board.

  • The world's top three chip manufacturers

    Under the background of chip shortage, chip is becoming a crucial field in the world. In the chip industry, Samsung and Intel have always been the world's largest IDM giants (integrating design, manufacturing and sealing and testing, basically without relying on others). For a long time, the Iron Throne of global chips was fought back and forth between the two until TSMC rose and the bipolar pattern was completely broken.

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