XCZU4CG-2SFVC784I Manufacturers

ADSP-21060LCW-160 Package: 240-BFCQFP bare pad Working temperature: -40-100 Lot number: 2023+ Quantity: 260PCS in the global hot sale

Thin film circuit board has good thermal and electrical properties, and is an excellent material for power LED packaging. Thin film circuit board is especially suitable for packaging structures such as multi-chip (MCM) and substrate directly bonded chip (COB); it can also be used as other high-power The heat dissipation circuit board of the power semiconductor module.

10AX066H3F34I2LG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

​The XCVU5P-2FLVA2104I Virtex UltraScale+device is a high-performance FPGA based on 14nm/16nm FinFET nodes, supporting 3D IC technology and various computationally intensive applications.

Megtron7 High speed PCB -- high speed circuit design technology has become a design method that electronic system designers must adopt. Only by using the design technology of high-speed circuit designer can the controllability of design process be realized.

​XCKU085-3FLVA1517E is a high-performance FPGA product from Xilinx, packaged in BGA-1517. This FPGA has an astonishing 1088325 logic components, enabling it to handle extremely complex logic operations. Meanwhile, it has 672 I/O ports, making data transmission and interaction more efficient.