XCZU3EG-1SFVC784I Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • XC3S700A-4FGG484I

    XC3S700A-4FGG484I

    ​XC3S700A-4FGG484I is a high-performance, step-down DC-DC power module developed by Analog Devices, a leading semiconductor technology company. This device features a wide input voltage range of 6V to 36V and a maximum output current of 5A.
  • HI-8591PSI

    HI-8591PSI

    HI-8591PSI is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7K410T-3FFG900E

    XC7K410T-3FFG900E

    ​XC7K410T-3FFG900E is a user configurable analog interface (XADC) that integrates dual 12 bit 1MSPS analog-to-digital converters with on-chip thermal and power sensors.
  • XC3S1200E-4FGG400C

    XC3S1200E-4FGG400C

    XC3S1200E-4FGG400C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 10CL016YF484I7G

    10CL016YF484I7G

    ​10CL016YF484I7G Intel 10CL016YF484I7G Cyclone ® The 10 LP FPGA has been optimized for low cost and low static power consumption, making it an ideal choice for large-scale and cost sensitive applications. The Intel Cyclone 10 LP device provides high-density programmable gates, onboard resources, and general-purpose I/O. These resources can meet the requirements of I/O expansion and chip to chip interface
  • XC3S250E-4PQG208I

    XC3S250E-4PQG208I

    XC3S250E-4PQG208I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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