XCZU2CG-2SFVC784I Manufacturers

We emphasize growth and introduce new goods into the market every year for XCZU2CG-2SFVC784I, Our aim is "blazing new ground, Passing Value", in the future, we sincerely invite you to grow up with us and make a bright future together!
XCZU2CG-2SFVC784I, We have customers from more than 20 countries and our reputation has been recognized by our esteemed customers. Never-ending improvement and striving for 0% deficiency are our two main quality policies. Should you need anything, don't hesitate to contact us.

Hot Products

XCZU9CG-L1FFVC900I
XCZU9CG-L1FFVC900I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
MT60B3G8RW-56B:B
MT60B3G8RW-56B:B is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
XCKU085-L1FLVB1760I
XCKU085-L1FLVB1760I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
EPM3256ATC144-10N
EPM3256ATC144-10N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
BCM5389KFBG
BCM5389KFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
MT41K128M16JT-125AAT:K
MT41K128M16JT-125AAT:K is a type of dynamic random-access memory (DRAM) module commonly used in computer systems. It has a capacity of 2 GB and a data transfer rate of 1600 megatransfers per second (MT/s).

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Difference between missing printing covering layer and laminated covering film of FPC circuit board
After the covering film of FPC circuit board is positioned, it is necessary to heat and pressurize to make the adhesive completely solidified and integrated with the circuit.
What should be paid attention to in the anti-corrosion treatment of multilayer circuit boards
What should be paid attention to in the anti-corrosion treatment of multilayer circuit boards
PCB production, these matters you must pay attention to!
People who make circuit boards know that the production process is very complex~
What is an integrated circuit?
An Integrated Circuit (IC), also commonly known as a microchip or chip, is a miniaturized electronic circuit that consists of multiple interconnected semiconductor devices, such as transistors, diodes, resistors, and capacitors, fabricated on a single semiconductor substrate, usually made of silicon. The components on an integrated circuit are designed to perform specific electronic functions, and the entire circuit is manufactured as a single unit.
Precautions for FPC flexible circuit board packaging
Special attention should also be paid to the packaging of finished products of flexible circuit boards, rather than simply stacking an appropriate number of flexible boards together at will. Due to the complex structure of flexible printed board
According to the number of microelectronic devices integrated on a chip, integrated circuits can be divided into the following categories:
According to the number of microelectronic devices integrated on a chip, integrated circuits can be divided into the following categories:

XCZU2CG-2SFVC784I Manufacturers

Related Products

Hot Products

XCZU9CG-L1FFVC900I

MT60B3G8RW-56B:B

XCKU085-L1FLVB1760I

EPM3256ATC144-10N

BCM5389KFBG

MT41K128M16JT-125AAT:K

Difference between missing printing covering layer and laminated covering film of FPC circuit board

What should be paid attention to in the anti-corrosion treatment of multilayer circuit boards

PCB production, these matters you must pay attention to!

What is an integrated circuit?

Precautions for FPC flexible circuit board packaging

According to the number of microelectronic devices integrated on a chip, integrated circuits can be divided into the following categories:

Jean Ascher 2024-09-15 01:34:49

Steven 2023-10-13 23:24:10

Henry stokeld 2021-01-01 10:36:00

Mark 2023-07-17 15:18:12

Catherine 2023-06-13 03:37:43

Evangeline 2022-12-05 11:44:43

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An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.