XCZU28DR-2FFVD1156I Manufacturers

XC2C384-7TQG144C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

EP4SGX180KF40C3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

XC6SLX100T-2FGG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

The so-called Buried Copper Coin PCB is a PCB board in which a copper Coin is partially embedded on the PCB. The heating elements are directly attached to the surface of the copper Coin board, and the heat is transferred out through the copper Coin.

XC6SLX75T-3FGG676C is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. It offers a large number of logic cells, distributed memory, and DSP slices, making it suitable for a wide range of applications. This device has 74,880 logic cells, 3.5 Mb of distributed RAM, 180 DSP slices, and 8 clock management tiles.

5CSEBA6U23C7N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.