XCZU21DR-2FFVD1156E Manufacturers

With our loaded working experience and thoughtful products and services, we've got been acknowledged as a reputable supplier for most international buyers for XCZU21DR-2FFVD1156E, Accurate process devices, Advanced Injection Molding Equipment, Equipment assembly line, labs and software progress are our distinguishing feature.
XCZU21DR-2FFVD1156E, We can meet the various needs of customers at home and abroad. We welcome new and old customers to come to consult & negotiate with us. Your satisfaction is our motivation! Let us work together to write a brilliant new chapter!

Hot Products

  • XCVU7P-2FLVB2104I

    XCVU7P-2FLVB2104I

    ​XCVU7P-2FLVB2104I is an FPGA chip produced by Xilinx, belonging to Xilinx's XCVU7P series. This chip has high-speed connectivity capabilities and supports 150G Interlake and 100G Ethernet MAC cores, enabling high-speed data transmission and processing.
  • EP3SL110F1152I4N

    EP3SL110F1152I4N

    EP3SL110F1152I4N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AX115H3F34E2SG

    10AX115H3F34E2SG

    ​10AX115H3F34E2SG is an FPGA (Field Programmable Gate Array) chip, belonging to the Arria 10 GX 1150 series, produced by Intel (formerly Altera Corporation). This chip adopts BGA (Ball Grid Array) packaging form, with 504 I/O interfaces and a packaging form of 1152FBGA
  • XC6SLX25-2FGG484C

    XC6SLX25-2FGG484C

    XC6SLX25-2FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7V585T-2FFG1761I

    XC7V585T-2FFG1761I

    ​XC7V585T-2FFG1761I has been optimized for the highest system performance and capacity, resulting in a 2x increase in system performance. The highest performance device using stacked silicon interconnect (SSI) technology.
  • LTC4090EDJC#PBF

    LTC4090EDJC#PBF

    LTC4090EDJC#PBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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