XCZU19EG-2FFVC1760I Manufacturers

"Quality 1st, Honesty as base, Sincere assistance and mutual profit" is our idea, in order to create consistently and pursue the excellence for XCZU19EG-2FFVC1760I, You may find the lowest price here. Also you will get high quality products and excellent service here! Please do not hesitate to contact us!
XCZU19EG-2FFVC1760I, With the growing of the company, now our items sold and served at more than 15 countries around the world,such as Europe,North America,Middle-east,South America,Southern Asia and so on. As we bear in our mind that innovation is essential to our growth, new product development is constantly.Besides, Our flexible and efficient operation strategies,High quality products and solutions and competitive prices are exactly what our customers are looking for. Also a considerable service brings us good credit reputation.

Hot Products

  • Ic carrier

    Ic carrier

    IC carrier: generally, it is a board on the chip. The board is very small, generally, it is 1/4 nail cover size, and the board is very thin 0.2-0. The material used is FR-5, BT resin, and its circuit is about 2mil / 2mil. For high-precision boards, it used to be produced in Taiwan, but now it is developing to the mainland.
  • 22Layer RF PCB

    22Layer RF PCB

    22Layer RF PCB a radiofrequenza HONTEC lavora a stretto contatto con il team di progettazione del prodotto per garantire che gli obiettivi di costo/prestazioni del progetto siano raggiunti fornendo informazioni sulle opzioni dei materiali, sui costi relativi e sui problemi DFM. Nella foto, 22L RF - Materiale per radiofrequenza; THK: 2,45 mm; finitura superficiale: ENIG; controllo dell'impedenza.
  • 10M25DAF256C8G

    10M25DAF256C8G

    ​10M25DAF256C8G is a MAX 10 series FPGA chip produced by Intel (formerly Altera). The chip has 25000 logic elements, supports 178 I/O ports, and is packaged in FBGA-256.
  • 8-layer rigid-Flex PCB

    8-layer rigid-Flex PCB

    8-layer rigid-Flex PCB has the characteristics of bending and folding, so it can be used to make customized circuit, maximize the indoor available space, use this point, reduce the space occupied by the whole system, the overall cost of rigid Flex PCB will be relatively high, but with the continuous maturity and development of the industry, the overall cost will continue to reduce, so it will be more cost-effective and competitive power.
  • XCKU035-2FBVA676E

    XCKU035-2FBVA676E

    XCKU035-2FBVA676E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP4SGX360FF35C3N

    EP4SGX360FF35C3N

    ​EP4SGX360FF35C3N is a type of FPGA (Field Programmable Gate Array) made by Intel (formerly Altera). This specific FPGA has 360,000 Logic Elements, operates at a speed of up to 840 MHz, and features 31.8 Mb of embedded memory,

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