XCZU17EG-1FFVB1517E Manufacturers

While in the past few years, our organization absorbed and digested sophisticated technologies both equally at home and abroad. Meanwhile, our corporation staffs a group of experts devoted to your advancement of XCZU17EG-1FFVB1517E, As an expert specialized with this field, we have been committed to solving any problem of significant temperature protection for users.
XCZU17EG-1FFVB1517E, Our company offers the full range from pre-sales to after-sales service, from product development to audit the use of maintenance, based on strong technical strength, superior product performance, reasonable prices and perfect service, we are going to continue to develop, to supply the high-quality merchandise and services, and promote lasting cooperation with our customers, common development and create a better future.

Hot Products

  • XCKU3P-2SFVB784I

    XCKU3P-2SFVB784I

    XCKU3P-2SFVB784I is a Field-Programmable Gate Array (FPGA) chip from Xilinx's Kintex UltraScale+ family, which is a high-performance FPGA designed with advanced features and capabilities. The chip features 2.6 million logic cells, 2604 DSP slices, and 47 Mb UltraRAM, and is built using a 20nm process technology
  • XCKU15P-L2FFVE1760E

    XCKU15P-L2FFVE1760E

    ​XCKU15P-L2FFVE1760E Kinex ® UltraScale+ ™ The device can achieve a balance between required system performance and extremely low power consumption, while supporting packet processing and DSP intensive functions, making it an ideal choice for wireless MIMO technology, Nx100G wired networks, as well as data center networks and storage acceleration applications
  • XC7K325T-1FBG900C

    XC7K325T-1FBG900C

    XC7K325T-1FBG900C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM65238C0IFSBG

    BCM65238C0IFSBG

    BCM65238C0IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6VLX365T-2FFG1759I

    XC6VLX365T-2FFG1759I

    ​XC6VLX365T-2FFG1759I Packaging BGA integrated circuit chips, IC electronic components, inquiry and order. Our company has professional supply chain services at multiple levels, including forecasting, contracts, stocking, in transit, inventory, and credit, to help customers shorten product procurement cycles, reduce inventory, lower costs, and improve market response speed,
  • High frequency step PCB

    High frequency step PCB

    High frequency step PCB With the small and diversified development of electronic products, restricted by the space and security, the traditional plane circuit board can not meet the requirements of many fields of electronic products, and more and more step PCB has been gradually developed.

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