XCZU15EG-2FFVC900I Manufacturers

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Hot Products

TDA201-001V03
TDA201-001V03 is a high-definition military LCD launched by BOE. It is currently in short supply and the annual production capacity is insufficient. The production time is generally about half a year.
LTM4700IY#PBF
LTM4700IY#PBF is a dual channel 50A or single channel 100A buck type μ Module ® (Power module) DC/DC regulator, equipped with digital power system management function, achieves remote configurability and telemetry monitoring of power management parameters through PMBus (an open standard digital interface protocol based on I2C)
10CL006YU256I7G
10CL006YU256I7G is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
BCM56265B0KFSBG
The BCM56265B0KFSBG is a high-performance networking chip designed and manufactured by Broadcom Limited. Belonging to the esteemed StrataXGS family of switches, this chip offers a robust solution for a wide range of networking applications, including but not limited to enterprise networks, data centers, and service provider environments.
10M25DAF484C8G
10M25DAF484C8G is an FPGA (Field Programmable Gate Array) product produced by Altera (now acquired by Intel). This FPGA adopts FBGA484 package and has the following key features: Packaging form: FBGA484 packaging is used, which is a surface mount technology suitable for high-density integrated circuits. Working temperature range: The minimum working temperature is -40 ° C, and the maximum working temperature is 130 ° C, suitable for applications under various environmental conditions.
XC7K160T-2FFG676I
XC7K160T-2FFG676I is a BGA chip launched by XILINX, category: Embedded-FPGA (Field Programmable Gate Array), brand: XILINX, original authentic, stock in stock

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High Frequency Printed Circuit Board
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When designing a four-layer PCB circuit board, how is the stack-up generally designed?
When designing a four-layer PCB circuit board, how is the stack-up generally designed?
Semiconductor supporting industry
The semiconductor support industry mainly includes semiconductor materials, semiconductor equipment and semiconductor software services:
Forecast and analysis of market status and development prospects of China's semiconductor equipment industry in 2022
China business information network news: semiconductor is a kind of material with conductivity between conductor and insulator at normal temperature. It is also a material with controllable conductivity, ranging from insulator to conductor.
PCB modular layout ideas
Faced with the increasingly high integration of hardware platforms and more and more complex electronic systems, the PCB layout should have a modular thinking, which requires the use of modularity in the design of hardware schematics and PCB wiring. , Structured design method. As a hardware engineer, on the premise of understanding the overall architecture of the system, first of all, we should consciously merge modular design ideas in the schematic diagram and PCB wiring design, combined with the actual situation of the PCB, plan the basic idea of PCB layout.
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XCZU15EG-2FFVC900I Manufacturers

Related Products

Hot Products

TDA201-001V03

LTM4700IY#PBF

10CL006YU256I7G

BCM56265B0KFSBG

10M25DAF484C8G

XC7K160T-2FFG676I

High Frequency Printed Circuit Board

When designing a four-layer PCB circuit board, how is the stack-up generally designed?

Semiconductor supporting industry

Forecast and analysis of market status and development prospects of China's semiconductor equipment industry in 2022

PCB modular layout ideas

Qualcomm Huawei competes for 5G standard: the same day announced the completion of 5G connection under the new specification

Gabrielle 2024-08-14 12:09:42

Dana 2020-06-11 13:58:04

Samantha 2021-09-02 18:58:25

Marco 2021-09-17 23:20:42

Nana 2024-08-19 11:48:03

Miranda 2020-11-08 04:01:36

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An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.