XCVU5P-3FLVB2104E Manufacturers

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Hot Products

  • XCKU3P-2SFVB784I

    XCKU3P-2SFVB784I

    XCKU3P-2SFVB784I is a Field-Programmable Gate Array (FPGA) chip from Xilinx's Kintex UltraScale+ family, which is a high-performance FPGA designed with advanced features and capabilities. The chip features 2.6 million logic cells, 2604 DSP slices, and 47 Mb UltraRAM, and is built using a 20nm process technology
  • 4.25g Optical Module PCB

    4.25g Optical Module PCB

    The main reason for using SFF on the ONU side is that the ONU products of the EPON system are usually placed on the user side and require fixed, not hot-swappable. With the rapid development of PON technology, SFF is gradually replaced by BOB.The following is about 4.25g Optical Module PCB related, I hope to help you better understand 4.25g Optical Module PCB.
  • XCKU040-2FBVA676E

    XCKU040-2FBVA676E

    ​XCKU040-2FBVA676E is a Kintex based ® The UltraScale architecture FPGA (Field Programmable Gate Array) chip is produced by AMD (formerly Xilinx). It has high performance and flexible programmability, suitable for a wide range of application fields such as data centers
  • 10M04SCU169I7G

    10M04SCU169I7G

    ​10M04SCU169I7G is a MAX 10 series FPGA chip produced by Intel (formerly Altera). This chip belongs to the field programmable gate array (FPGA) and has non-volatile characteristics, providing 130 I/O ports and UBGA-169 package. It supports a working voltage of 3.3V, a working temperature range of -40 ° C to+100 ° C, and a maximum working frequency of 450MHz
  • XC7S75-2FGGA484I

    XC7S75-2FGGA484I

    XC7S75-2FGGA484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU5P-1FLVB2104I

    XCVU5P-1FLVB2104I

    ​XCVU5P-1FLVB2104I is an FPGA chip produced by Xilinx, belonging to the UltraScale+series. This chip integrates up to 1.5 million system logic units and utilizes second-generation 3D integrated circuit technology to integrate multiple PCI Express Gen3 cores, improving system performance

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