XCVU37P-1FSVH2892E Manufacturers

Assume full obligation to meet all demands of our customers; accomplish ongoing advancements by promoting the advancement of our customers; become the final permanent cooperative partner of clientele and maximize the interests of shoppers for XCVU37P-1FSVH2892E, Let's cooperate hand in hand to jointly make a beautiful future. We sincerely welcome you to visit our company or contact us for cooperation!
XCVU37P-1FSVH2892E, In order to meet more market demands and long-term development, a 150, 000-square-meter new factory is under construction, which might be put into use in 2014. Then, we shall own a large capacity of producing. Of course, we will continue improving the service system to meet the requirements of customers, bringing health, happiness and beauty to everyone.

Hot Products

XCVU9P-2FLGA2104I
As a member of the FPGA chip, XCVU9P-2FLGA2104I has 2304 programmable logic units (PLs) and 150MB of internal memory, providing a clock frequency of up to 1.5 GHz. Provided 416 input/output pins and 36.1 Mbit distributed RAM. It supports field programmable gate array (FPGA) technology and can achieve flexible design for various applications
XC4VLX40-10FF668C
XC4VLX40-10FF668C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
Ladder PCB
Ladder PCB technology can reduce the thickness of PCB locally, so that the assembled devices can be embedded in the thinning area, and realize the bottom welding of ladder, so as to achieve the purpose of overall thinning.
8-layer FR408HR PCB
8-layer FR408HR PCB substrate is suitable for: special substrate for communication and big data industries.The following is about 8 layer FR408HR, I hope to help you better understand 8 layer FR408HR.
XC18V02VQG44C
XC18V02VQG44C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
10AX115H3F34I2SG
10AX115H3F34I2SG adopts a 20 nanometer process, which can provide high performance, supporting chip to chip data transmission rates of up to 17.4 Gbps, backplane data transmission rates of up to 12.5 Gbps, and up to 1.15 million equivalent logic units.

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Reviews

Thermal stress treatment quality of heavy copper PCB
When designing a circuit, factors such as thermal stress are very important, and engineers should eliminate thermal stress as much as possible. Over time, PCB manufacturing processes have continued to evolve, and various PCB technologies have been invented, such as aluminum PCBs, which can handle thermal stress. It is in the interests of heavy copper PCB designers to minimize the power budget while maintaining the circuit. Performance and environmentally friendly design with heat dissipation performance.
According to the number of microelectronic devices integrated on a chip, integrated circuits can be divided into the following categories:
According to the number of microelectronic devices integrated on a chip, integrated circuits can be divided into the following categories:
Circuit thinning drives high-end micro-drill business opportunities
Due to the continuous introduction of thin, light and short products in the market, the high-function, high-speed and other double-height era has been developed, and the trend of high-frequency, high-speed, and multi-IO chips has been developed.
"Electronic Manufacturing Pavilion" of Shenzhen Electronic Equipment Association will become the new highlight of CITE2017
With the emergence of new technologies such as the Internet of Things and cloud computing, a series of new changes have occurred in the manufacturing industry in 2016.
Development history of electronic components
The development history of electronic components is actually a condensed history of electronic development. Electronic technology is a new technology developed at the end of the 19th century and the beginning of the 20th century. It has developed most rapidly and been widely used in the 20th century. It has become an important symbol of the development of modern science and technology.
Microprocessor vs. Integrated Circuit in Electronics Design
You’re likely to deal with integrated circuits in electronics design. Occasionally, you may face the herculean task of working with a microprocessor. It’s a mistake to assume that designing with a microprocessor is similar to typical ICs.

XCVU37P-1FSVH2892E Manufacturers

Related Products

Hot Products

XCVU9P-2FLGA2104I

XC4VLX40-10FF668C

Ladder PCB

8-layer FR408HR PCB

XC18V02VQG44C

10AX115H3F34I2SG

Thermal stress treatment quality of heavy copper PCB

According to the number of microelectronic devices integrated on a chip, integrated circuits can be divided into the following categories:

Circuit thinning drives high-end micro-drill business opportunities

"Electronic Manufacturing Pavilion" of Shenzhen Electronic Equipment Association will become the new highlight of CITE2017

Development history of electronic components

Microprocessor vs. Integrated Circuit in Electronics Design

Lydia 2020-10-19 16:43:21

Erica 2022-07-12 12:54:14

Edward 2022-03-26 06:56:40

Prima 2022-12-18 20:32:38

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Modesty 2022-01-28 23:10:46

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An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.