XCVU29P-1FSGA2577E Manufacturers

No matter new buyer or aged buyer, We believe in prolonged expression and trustworthy relationship for XCVU29P-1FSGA2577E, We are devoted to provide professional purification technology and solutions for you!
XCVU29P-1FSGA2577E, we've got complete material production line, assembling line , quality control system, and the most importantly, we have many patents technology and experienced technical&production team, specialist sales service team. With all these advantages, we are gonna create"the reputable international brand of nylon monofilaments", and spreading our goods to every corner of the world. We have been keep moving and try our best to serve our customers.

Hot Products

  • XC95144XL-10TQG100C

    XC95144XL-10TQG100C

    XC95144XL-10TQG100C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX415T-2FFG1158I

    XC7VX415T-2FFG1158I

    ​XC7VX415T-2FFG1158I Field Programmable Gate Array (FPGA) is a device that uses stacked silicon interconnect (SSI) technology and can meet the system requirements of various applications. FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnect system. Suitable for applications such as 10G to 100G networks, portable radar, and ASIC prototype design.
  • XC6SLX4-2CPG196C

    XC6SLX4-2CPG196C

    XC6SLX4-2CPG196C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Megtron6 step PCB

    Megtron6 step PCB

    In addition to the requirement for uniform thickness of the plating layer for drilling, backplane designers generally have different requirements for the uniformity of copper on the surface of the outer layer. Some designs etch few signal lines on the outer layer. The following is about Megtron6 step PCB related, I hope to help you better understand Megtron6 step PCB.
  • Red High speed Backplane

    Red High speed Backplane

    Traditionally, for reliability reasons, passive components have tended to be used on the backplane. However, in order to maintain the fixed cost of the active board, more and more active devices such as BGA are designed on the backplane.The following is about Red High speed Backplane. related, I hope to help you better understand Red High speed Backplane.
  • 5CEBA9F23C7N

    5CEBA9F23C7N

    ​5CEBA9F23C7N is a Cyclone V series FPGA chip produced by Intel (formerly Altera). This chip has high performance and flexibility, suitable for various complex design requirements. Its main features include:

Send Inquiry