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XCVU190-2FLGA2577I Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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    XC7VX690T-1FFG1927C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
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    LTM4668IY#PBF

    LTM4668IY#PBF is an electronic component, packaged in BGA-49 and produced by LINEAR/Lingte. The batch inventory information of this component shows that it is widely used in different electronic devices. Specifically, LTM4668IY # PBF belongs to µ Module ® The series
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    10 Layer 4Step HDI PCB

    HDI is the English abbreviation of High Density Interconnector, high-density interconnect (HDI) manufacturing printed circuit board. The printed circuit board is a structural element formed by insulating material supplemented by conductor wiring. The following is about 10 Layer 4Step HDI PCB related, I hope to help you better understand 10 Layer 4Step HDI PCB.
  • 5CGXFC7D6F27C7N

    5CGXFC7D6F27C7N

    ​5CGXFC7D6F27C7N is a Cyclone V GX series FPGA chip produced by Intel (formerly Altera). The chip is packaged in FBGA-672 and has 149500 logic units and 336 I/O ports, supporting system programmability and reprogramming. Its working power supply voltage range is 1.07V to 1.13V
  • XCVU9P-L2FLGA2104E

    XCVU9P-L2FLGA2104E

    XCVU9P-L2FLGA2104E is a Virtex UltraScale+ FPGA chip from Xilinx, a leading provider of programmable logic solutions. This chip is part of Xilinx's high-performance Virtex UltraScale+ series and features 4.5 million logic cells, 83,520 DSP slices, and 1,728 Mb of UltraRAM
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    Meg6 High-speed Backplane

    32-Layer Meg6 High-speed Backplane With the large-scale improvement of system design complexity and integration, electronic system designers are engaged in circuit design above 100MHZ. The operating frequency of the bus has reached or exceeded 50MHZ, and some even exceeded 100MHZ. The following is about 32 Layer Meg6 High-speed Backplane related, I hope to help you better understand 32 Layer Meg6 High-speed Backplane.
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