Products
Home > Products > XCVU13P-3FHGB2104E

XCVU13P-3FHGB2104E Manufacturers

We believe that prolonged time period partnership is really a result of top of the range, benefit added provider, prosperous knowledge and personal contact for XCVU13P-3FHGB2104E, we could solve our customer problems asap and do the profit for our customer. For those who need superior provider and excellent , pls choose us , thanks !
XCVU13P-3FHGB2104E, Our products have mainly exported to south-east Asia Euro-America, and sales to all of our country. And depending on excellent quality, reasonable price, best service, we have got good feedback from customers overseas. You are welcomed to join us for more possibilities and benefits. We welcome customers, business associations and friends from all parts of the world to contact us and seek cooperation for mutual benefits.

Related Products

Hot Products

  • TPS63060DSCR

    TPS63060DSCR

    TPS63060DSCR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AX066K3F40I2LG

    10AX066K3F40I2LG

    10AX066K3F40I2LG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU11P-1FLGB2104E

    XCVU11P-1FLGB2104E

    ​XCVU11P-1FLGB2104E is an FPGA (Field Programmable Gate Array) product produced by Xilinx, belonging to the Virtex UltraScale series. This FPGA has the following features and specifications:
  • XC3S200-4PQG208C

    XC3S200-4PQG208C

    XC3S200-4PQG208C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX25T-2FGG484C

    XC6SLX25T-2FGG484C

    XC6SLX25T-2FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Ceramic PCB

    Ceramic PCB

    Ceramic PCB substrate is a 96% aluminum oxide ceramic double-sided copper clad substrate, which is mainly used in high-power module power supplies, high-power LED lighting substrates, solar photovoltaic substrates, high-power microwave power devices, which have high thermal conductivity, high pressure resistance, high temperature resistance, solderability resistance.
  • Related Blog
  • Reviews

  • What is an integrated circuit?

    An Integrated Circuit (IC), also commonly known as a microchip or chip, is a miniaturized electronic circuit that consists of multiple interconnected semiconductor devices, such as transistors, diodes, resistors, and capacitors, fabricated on a single semiconductor substrate, usually made of silicon. The components on an integrated circuit are designed to perform specific electronic functions, and the entire circuit is manufactured as a single unit.

  • What the hell is a chip

    Chips are large-scale, microelectronic integrated circuits. That is, the printed circuit board is scaled down to nanometer (one millionth of a millimeter). On the front of the traditional printed circuit board, there are a large number of radio components, including triodes, diodes, capacitors, electrolysers, resistors, mid cycle regulators, switches, power amplifiers, detectors, filters, and so on.

  • Printed circuit boards can be seen everywhere. Do you know how difficult it is to make them

    In the production of electronic products, there will be a production process of printed circuit board. Printed circuit boards are used in electronic products in all industries. It is the carrier of electronic schematic diagram that can realize the design function and turn the design into physical products

  • What does semiconductor mean

    Semiconductors are mainly composed of four parts: integrated circuits, optoelectronic devices, discrete devices, and sensors. However, since integrated circuits account for 80% of them, laypeople generally consider integrated circuits as semiconductors. In integrated circuits, they are further divided into microprocessors, memory, logic devices, and analog devices. These small box like things are actually what we commonly refer to as chips.

  • FPC circuit board manufacturing process

    Flow chart of single-sided FPC circuit board: engineering documents - copper foil - Pretreatment - press dry film - exposure - Development - etching - film stripping - AOI - Pretreatment - coating film (or ink printing) - pretreatment before electroplating - electroplating - post electroplating - reinforcement - appearance punching - electrical measurement - appearance inspection - shipment;

  • Causes and solutions of blistering in multilayer circuit boards

    Reasons for blistering of multilayer circuit board

Send Inquiry