XCVU125-3FLVB1760E Manufacturers

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XCVU125-3FLVB1760E, we've been sincerely hope to establish one good long term business relationship with your esteemed company thought this opportunity, based on equal, mutual beneficial and win win business from now till the future.

Hot Products

  • EP2SGX130GF1508I4N

    EP2SGX130GF1508I4N

    EP2SGX130GF1508I4N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7336Q-10PC44C

    XC7336Q-10PC44C

    XC7336Q-10PC44C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU19P-2FSVA3824E

    XCVU19P-2FSVA3824E

    Part status: Active LAB/CLB number: 510720 Logic components/units number: 8937600 Total RAM bits: 79586918I/O number: 1976 Number of gates: - Voltage - XCVU19P-2FSVA3824E Power supply: 0.825V~0.876V Installation type: Surface mount type Working temperature: 0 ° C~100 ° C (TJ) Product packaging: 3824-BBGA, FCBGA
  • XC6SLX45-2CSG484I

    XC6SLX45-2CSG484I

    XC6SLX45-2CSG484I has 43661 logic components, 2.04 Mbit embedded memory, minimum operating temperature bit -40 C, maximum operating temperature bit+100 C. Provide industry-leading connectivity features such as high logic pin ratio, small-sized packaging, MicroBlaze? Soft processors, and various supported I/O protocols. It is an ideal choice for advanced bridging applications in consumer products, automotive information and entertainment systems, and industrial automation applications
  • XC3S700A-4FGG484C

    XC3S700A-4FGG484C

    XC3S700A-4FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU080-2FFVB1760E

    XCVU080-2FFVB1760E

    ​XCVU080-2FFVB1760E is an FPGA (Field Programmable Gate Array) product produced by Xilinx, belonging to the Kintex UltraScale series. This FPGA has the following features and specifications:

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