XCVU095-H1FFVC1517E Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • EP4CE15F23C8N

    EP4CE15F23C8N

    ​EP4CE15F23C8N The Cyclone IV E equipment provides -6 (fastest), -7, -8, -8L, and -9L speed levels for commercial equipment, -8L speed level for industrial equipment, and -7 speed level for expanding industrial and automotive equipment. The Cyclone IV GX equipment provides -6 (fastest), -7, and -8 speed levels for commercial equipment and -7 speed levels for industrial equipment.
  • XC6SLX150-3FGG676I

    XC6SLX150-3FGG676I

    ​XC6SLX150-3FGG676I Packaging BGA integrated circuit chips, IC electronic components, inquiry and order placement
  • Robot 3step HDI PCB

    Robot 3step HDI PCB

    The heat resistance of the Robot 3step HDI PCB is an important item in the reliability of HDI. The thickness of the Robot 3step HDI Circuit Board becomes thinner and thinner, and the requirements for its heat resistance are getting higher and higher. The advancement of the lead-free process has also increased the requirements for the heat resistance of HDI boards. Since the HDI board is different from the ordinary multilayer through-hole PCB board in terms of layer structure, the heat resistance of the HDI board is the same as that of ordinary multilayer through-hole PCB board is different.
  • XC7Z007S-1CLG400I

    XC7Z007S-1CLG400I

    XC7Z007S-1CLG400I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP3SE110F1152I3N

    EP3SE110F1152I3N

    EP3SE110F1152I3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC6SLX45-3FGG676C

    XC6SLX45-3FGG676C

    XC6SLX45-3FGG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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