XCS20-3TQ144I Manufacturers

Sticking to the principle of "Super Good quality, Satisfactory service" ,We are striving to become an excellent organization partner of you for XCS20-3TQ144I, Our goal is always to enable clients comprehend their plans. We have been creating good endeavours to accomplish this win-win scenario and sincerely welcome you to join us.
XCS20-3TQ144I, We adopt advanced production equipment and technology, and perfect testing equipment and methods to ensure our product quality. With our high-level talents, scientific management, excellent teams, and attentive service, our products are favored by domestic and foreign customers. With your support, we will build a better tomorrow!

Hot Products

TPD1E10B06DPYR
TPD1E10B06DPYR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
XCZU19EG-3FFVC1760E
XCZU19EG-3FFVC1760E Zynq™ UltraScale+ ™ MPSoC devices have 64 bit processor scalability, combining real-time control with software and hardware engines, and are suitable for graphics, video, waveform, and packet processing applications
XCF02SVO20C
XCF02SVO20C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
10AS016E3F29I2SG
10AS016E3F29I2SG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
5CEFA9F23I7N
5CEFA9F23I7N adopts the FBGA-484 packaging method. This packaging has good heat dissipation performance and reliability, and can effectively protect the internal circuit of the chip.
XC7A50T-2FTG256C
The Xilinx XC7A50T-2FTG256C Artix ® -7 FPGA can achieve higher cost-effectiveness in multiple aspects, including logic, signal processing, embedded memory, LVDS I/O, memory interfaces, and transceivers. Artix-7 FPGA is highly suitable for cost sensitive applications that require high-end functionality.

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Reviews

This year, the cumulative sales of semiconductor equipment in Japan exceeded 75.6 billion, setting a record for the same period in history
According to the news from zhidongxi on June 28, according to money DJ in Taiwan, China, the cumulative sales of semiconductor equipment in Japan exceeded RMB 75.6 billion in May this year, the highest in the same period over the years
Foxconn changes cage to Phoenix and wants to regain market with 8K
Guo Taiming described its acquisition of Sharp and the introduction of 8K display technology as a replacement for the phoenix. Whether this phoenix can bring Guo Taiming the expected growth and prompt Foxconn to regain the market is still to be verified.
The growth rate of global chip market slowed down in the first quarter of 2022
Our reporter Shen Cong reported: the American Semiconductor Industry Association (SIA) recently released the data of the global chip market in the first quarter of 2022. The data show that the growth rate of the global chip market has slowed down significantly
Han's Laser's 2016 operating income was 6.959 billion yuan, a year-on-year increase of 24.55%
On April 24, Han's Laser released its 2016 annual report and a quarterly report for 2017. During the reporting period, it achieved operating income of 6.959 billion yuan, a year-on-year increase of 24.55%, and realized net profit of 754 million yuan. In 17Q1, profit increased by 31.50%, and the profit growth rate in the first half of the year is expected to be 60%-90%.
Precautions for processing covering film of FPC circuit board
The covering film of FPC circuit board shall be processed by opening the window, but it cannot be processed immediately after being taken out from the cold storage. Especially when the ambient temperature is high and the temperature difference is large, water droplets will condense on the surface.
How to distinguish PCB single-layer board and multi-layer board
According to the number of layers, there are three types of single-sided, double-sided, and multi-layer circuit boards, which are distinguished according to the circuit layers inside.

XCS20-3TQ144I Manufacturers

Related Products

Hot Products

TPD1E10B06DPYR

XCZU19EG-3FFVC1760E

XCF02SVO20C

10AS016E3F29I2SG

5CEFA9F23I7N

XC7A50T-2FTG256C

This year, the cumulative sales of semiconductor equipment in Japan exceeded 75.6 billion, setting a record for the same period in history

Foxconn changes cage to Phoenix and wants to regain market with 8K

The growth rate of global chip market slowed down in the first quarter of 2022

Han's Laser's 2016 operating income was 6.959 billion yuan, a year-on-year increase of 24.55%

Precautions for processing covering film of FPC circuit board

How to distinguish PCB single-layer board and multi-layer board

Martha 2023-11-21 11:28:59

Cornelia 2022-11-07 17:02:49

Diana 2020-07-25 01:04:34

Josephine 2022-06-27 12:39:40

Annabelle 2021-10-06 22:54:14

Alice 2022-08-06 17:19:00

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An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.