XCKU5P-2FFVB676I Manufacturers

XC6SLX16-3CPG196C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

TU-768 PCB refers to high heat resistance.General Tg plates are above 130 ° C, high Tg is generally more than 170 ° C, and medium Tg is about more than 150 ° C. Generally, Tg≥170 ° C PCB printed board is called high Tg printed board.

​EP4SGX230KF40I3N is a type of FPGA (Field Programmable Gate Array) made by Intel (formerly Altera). This specific FPGA has 230,000 Logic Elements, operates at a speed of up to 800 MHz, and features 17 Mb of embedded memory, 1,080 DSP blocks, and 24 high-speed transceiver channels.

XC5VLX50T-1FFG665I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

BCM56565B0KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

This chip provides 230K logic units and integrates multiple high-speed communication interfaces such as PCIe 2.0 x8, high-speed serial connectors DDR3 memory controller, etc. The chip adopts manufacturing technology based on the 40 nanometer process, which has advantages such as efficient processing capacity, low power EP4SGX230HF35C4G consumption, and low cost. This chip has a wide range of applications in high-performance computing, network communication, video transcoding, and image processing.