XCKU3P-2SFVB784I Manufacturers

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Hot Products

  • Megtron6 step PCB

    Megtron6 step PCB

    In addition to the requirement for uniform thickness of the plating layer for drilling, backplane designers generally have different requirements for the uniformity of copper on the surface of the outer layer. Some designs etch few signal lines on the outer layer. The following is about Megtron6 step PCB related, I hope to help you better understand Megtron6 step PCB.
  • XC3SD1800A-4CSG484C

    XC3SD1800A-4CSG484C

    XC3SD1800A-4CSG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU7CG-1FFVF1517E

    XCZU7CG-1FFVF1517E

    XCZU7CG-1FFVF1517E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX25-2CSG324C

    XC6SLX25-2CSG324C

    ​XC6SLX25-2CSG324C is a powerful, flexible and programmable FPGA chip with high performance, flexible programmability, rich communication interfaces, support for IP cores, and low power consumption. ‌‌
  • XC7S75-2FGGA676C

    XC7S75-2FGGA676C

    ​XC7S75-2FGGA676C is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, belonging to the Spartan-7 series. This chip has the following features and specifications:
  • XCZU11EG-2FFVC1760I

    XCZU11EG-2FFVC1760I

    ​XCZU11EG-2FFVC1760I series is based on Xilinx ® UltraScale MPSoC architecture. This series of products integrates feature rich 64 bit quad core or dual core Arm in a single device ® Cortex-A53 and dual core Arm Cortex-R5F basic processing system (PS) and Xilinx programmable logic (PL) UltraScale architecture. In addition, it also includes on-chip memory, multi port external memory interfaces, and rich peripheral connection interfaces.

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