XCKU095-2FFVC1517I Manufacturers

Attaining consumer satisfaction is our firm's purpose for good. We'll make wonderful efforts to produce new and top-quality merchandise, meet up with your special necessities and supply you with pre-sale, on-sale and after-sale products and services for XCKU095-2FFVC1517I, Our aim is to help customers realize their goals. We are making great efforts to achieve this win-win situation and sincerely welcome you to join us.
XCKU095-2FFVC1517I, In order to make more people know our items and to enlarge our market, we've got devoted a lot of attention to technical innovations and improvement, as well as replacement of equipment. Last but not the least, we also pay more attention to training our managerial personnel, technicians and workers in planned way.

Hot Products

  • High Thermal Conductivity PCB

    High Thermal Conductivity PCB

    The high thermal conductivity FR4 circuit board usually guides the thermal coefficient to be greater than or equal to 1.2, while the thermal conductivity of ST115D reaches 1.5, the performance is good, and the price is moderate. The following is about High Thermal Conductivity PCB related, I hope to help you better understand High Thermal Conductivity PCB.
  • Medical Equipment HDI PCB

    Medical Equipment HDI PCB

    HDI imaging, while achieving low defect rate and high output, can achieve stable production of HDI conventional high-precision operation. For example: advanced mobile phone board, CSP pitch is less than 0.5mm. The board structure is 3 + n + 3, there are three superposed vias on each side, and 6 to 8 layers of coreless printed boards with superimposed vias.The following is about Medical Equipment HDI PCB related, I hope to help you better understand Medical Equipment HDI PCB.
  • XC6SLX9-3CSG225C

    XC6SLX9-3CSG225C

    XC6SLX9-3CSG225C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC2S300E-6FGG456C

    XC2S300E-6FGG456C

    XC2S300E-6FGG456C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • MT29F4G08ABBDAH4-IT:D

    MT29F4G08ABBDAH4-IT:D

    MT29F4G08ABBDAH4-IT:D The Micron NAND flash device includes an asynchronous data interface for high-performance I/O operations. These devices use a highly multiplexed 8-bit bus (I/Ox) to transmit commands, addresses, and data.
  • 5SGXMA3H2F35C2N

    5SGXMA3H2F35C2N

    ​5SGXMA3H2F35C2N is a Stratix V GX series FPGA chip designed and produced by Intel. This chip belongs to the Stratix V GX series, with 340000 logic units and 1152 terminals, suitable for high-performance applications such as data centers, communications, and computer vision.

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