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XCKU060-2FFVA1156I Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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    XC7K325T-1FFG900I

    ​XC7K325T-1FFG900I Hongtai Fast Electronics, 100% in stock, complete in categories, only producing original equipment with a 15 year reputation, providing a safe and reliable electronic component procurement platform
  • EP2AGX190EF29I3G

    EP2AGX190EF29I3G

    ​The EP2AGX190EF29I3G Arria ® II GX low-power 6G transceiver FPGA effectively reduces costs and power consumption, providing stronger functionality for applications based on 6G transceivers. The 40 nm Arria II series includes the lowest cost 6.375-Gbps transceiver FPGA
  • XCVU11P-2FLGB2104I

    XCVU11P-2FLGB2104I

    ​XCVU11P-2FLGB2104I is an FPGA chip launched by Xilinx, which is part of the UltraScale architecture and designed to meet a wide range of application needs. This chip is a member of the Xilinx UltraScale series, which includes high-performance FPGA, MPSoC, and RFSoC,
  • TU102-875-A1

    TU102-875-A1

    TU102-875-A1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XA6SLX4-2CSG225Q

    XA6SLX4-2CSG225Q

    XA6SLX4-2CSG225Q is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP4S100G5F45I1N

    EP4S100G5F45I1N

    EP4S100G5F45I1N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
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  • Printed circuit boards can be seen everywhere. Do you know how difficult it is to make them

    In the production of electronic products, there will be a production process of printed circuit board. Printed circuit boards are used in electronic products in all industries. It is the carrier of electronic schematic diagram that can realize the design function and turn the design into physical products

  • C919 Chinese people just made a shell? Let's see what the insiders say

    The successful first flight of the C919 large passenger plane made many people excited. However, some different voices also appeared on the Internet: saying that many parts of this aircraft are imported goods, and some even said that the Chinese C919 just made a shell.

  • Addressing Coupling Capacitance in Designs

    Parasitic coupling between different nets occurs through parasitic inductance and capacitance. Coupling capacitance defines how easily signals can transfer between nets to produce a return path, crosstalk, or overall circuit impedance. Front-end design features in your circuit simulator can help you examine how the coupling capacitance in your nets will influence signal behavior.

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    At present, there are two general FPC welding processes, one is tin press welding, and the other is manual drag welding

  • Thermal stress treatment quality of heavy copper PCB

    When designing a circuit, factors such as thermal stress are very important, and engineers should eliminate thermal stress as much as possible. Over time, PCB manufacturing processes have continued to evolve, and various PCB technologies have been invented, such as aluminum PCBs, which can handle thermal stress. It is in the interests of heavy copper PCB designers to minimize the power budget while maintaining the circuit. Performance and environmentally friendly design with heat dissipation performance.

  • Installation mode of components on PCB printed circuit board

    Our common computer boards and cards are basically epoxy resin glass cloth based double-sided printed circuit boards. One side is the plug-in components, and the other side is the welding surface of the component feet. It can be seen that the welding points are very regular

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