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XCKU040-2FBVA676E Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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    ​10M04SCU169I7G is a MAX 10 series FPGA chip produced by Intel (formerly Altera). This chip belongs to the field programmable gate array (FPGA) and has non-volatile characteristics, providing 130 I/O ports and UBGA-169 package. It supports a working voltage of 3.3V, a working temperature range of -40 ° C to+100 ° C, and a maximum working frequency of 450MHz
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    XC7S15-2FTGB196C

    XC7S15-2FTGB196C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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    BCM63138SEKFSBG

    The BCM63138SEKFSBG is a high-performance multimedia gateway SoC (System-on-Chip) from Broadcom, a leading global semiconductor company specializing in wired and wireless communications technologies. This SoC is designed to meet the growing demands of multi-service and multimedia home gateway applications, providing a robust and scalable solution for telecom service providers.
  • XCVU190-3FLGB2104E

    XCVU190-3FLGB2104E

    ​XCVU190-3FLGB2104E is an FPGA (Field Programmable Gate Array) chip launched by Xilinx, which demonstrates strong application potential in multiple fields due to its high programmability, high computing performance, and low power consumption characteristics. This chip has a wide range of applications, including but not limited to
  • copper paste filled hole PCB

    copper paste filled hole PCB

    copper paste filled hole PCB: Bai AE3030 copper pulp is a non-conductive DAO copper paste used for the high-density assembly of printed substrate DU plate and the laying of wires.Due to the characteristics of Zhuan "high Thermal conductivity", "bubble-free", "flat" and so on, the copper paste is most suitable for the design of high reliability Pad on Via, stack on Via and Thermal Via. The copper paste is widely used from aerospace satellite, server, cabling machine, LED backlight and so on.
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    XC6SLX25-2FTG256I

    XC6SLX25-2FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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