XCF01SVOG20C Manufacturers

XC7VX690T-1FFG1158I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

​10M04SCU169I7G is a MAX 10 series FPGA chip produced by Intel (formerly Altera). This chip belongs to the field programmable gate array (FPGA) and has non-volatile characteristics, providing 130 I/O ports and UBGA-169 package. It supports a working voltage of 3.3V, a working temperature range of -40 ° C to+100 ° C, and a maximum working frequency of 450MHz

XC7K325T-1FBG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

XC5VSX50T-3FFG665C is an advanced field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 49,920 logic cells, 2.7 Mb of distributed RAM, and 400 Digital Signal Processing (DSP) slices, making it suitable for a wide range of high-performance applications. It operates on a 1.0V to 1.2V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCI Express. The -3 speed grade of this FPGA allows it to operate up to 500 MHz. The device comes in a flip-chip fine-pitch ball grid array (FFG665C) package with 665 pins, providing high pin-count connectivity for a variety of applications. XC5VSX50T-3FFG665C is commonly used in industrial automation, aerospace and defense, telecom, and high-performance computing applications. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it an excellent choice for mission-critical and high-reliability applications.

XC7A100T-1FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

HDI board (High Density Interconnector), that is, high-density interconnection board, is a circuit board with a relatively high line distribution density using micro-blind and buried via technology.The following is about 10 layers of HDI PCB, I hope to help you better understand 10 layers of HDI PCB.