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XCAU10P-1FFVB676E Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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  • XC7K325T-2FFG676C

    XC7K325T-2FFG676C

    XC7K325T-2FFG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • HI-8435PQIF

    HI-8435PQIF

    HI-8435PQIF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7Z045-2FFG900E

    XC7Z045-2FFG900E

    ​The XC7Z045-2FFG900E first generation architecture is a flexible platform that provides a fully programmable alternative to traditional ASIC and SoC users while launching new solutions. ARM® Cortex ™- The A9 processor comes in dual core (Zynq-7000) and single core (Zynq-7000S) Cortex-A9 configurations to choose from, providing integrated 28nm programmable logic per watt performance, with power consumption and performance levels exceeding those of discrete processors and FPGA systems
  • XC7A200T-1FFG1156C

    XC7A200T-1FFG1156C

    ​XC7A200T-1FFG1156C is an FPGA chip produced by Xilinx, belonging to the Artix-7 series. This chip is manufactured using advanced 28nm technology and has strong processing performance. Specific features include
  • HI-1573PCIF

    HI-1573PCIF

    HI-1573PCIF integrated circuit, abbreviated as IC; as the name implies, a certain number of commonly used electronic components, such as resistors, capacitors, transistors, etc., as well as the wiring between these components, are integrated by semiconductor technology to have specific functions.
  • XC3S400-5TQ144C

    XC3S400-5TQ144C

    XC3S400-5TQ144C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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  • Understand the structure of heavy copper PCB

    Heavy copper PCBs are manufactured with 4 ounces or more of copper on each layer. 4 ounce copper PCBs are most commonly used in commercial products. The concentration of copper can be as high as 200 ounces per square foot.

  • What is a semiconductor? What is the current situation of the industry? Which one is stronger in China?

    We usually refer to metals with good conductivity such as gold, silver, copper, iron, tin and aluminum as conductors. At the same time, materials with poor conductivity, such as coal, artificial crystals, amber, ceramics, etc., are called insulators. Then, we can simply call the material between the conductor and the insulator semiconductor.

  • Analysis of the Current Development Status and Prospects of Semiconductor Application Industry in China

    In the 1980s, China began to enter the semiconductor industry. In the early days, semiconductor technology mainly relied on imports, while China mainly engaged in simple assembly and testing work. At that time, major enterprises such as Shanghai Hongli and East China Semiconductor had a significant gap between their product technology level and the international advanced level, but it laid the foundation for the Chinese semiconductor industry

  • The growth rate of global chip market slowed down in the first quarter of 2022

    Our reporter Shen Cong reported: the American Semiconductor Industry Association (SIA) recently released the data of the global chip market in the first quarter of 2022. The data show that the growth rate of the global chip market has slowed down significantly

  • Advantages and disadvantages of multilayer boards

    Multilayer boards were invented in 1961. Its production method is generally to make the inner layer graphics first, and then use the printing and etching method to make a single-sided or double-sided substrate, and incorporate it into the designated interlayer, and then heat, press and bond it. As for the subsequent drilling, It is the same as the plated through-hole method of the double-sided board.

  • The competition of printed circuit board is fierce, and the high-end field has become a new focus

    Printed circuit board (PCB) is a substrate for assembling electronic parts. It is a printed board that forms the connection between points and printed components on the general substrate according to the predetermined design. According to different classification methods

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