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XC9572XL-5TQ100C Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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    XC6SLX25-2CSG324I

    XC6SLX25-2CSG324I has various speed levels, with -3 having the highest performance. The DC and AC electrical parameters of the automotive XA Spartan-6 FPGAs and defense grade Spartan-6Q FPGAs devices are equivalent to commercial specifications, unless otherwise specified. The timing characteristics of commercial (XC) -2 speed level industrial devices are the same as those of commercial -2 speed level devices- The 2Q and -3Q speed levels are specifically designed for expanding the (Q) temperature range. The timing characteristics are comparable to those of the -2 and -3 speed levels of automotive and defense grade devices. Product attributes
  • XCKU11P-2FFVA1156I

    XCKU11P-2FFVA1156I

    XCKU11P-2FFVA1156I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2SGX90EF1152C4N

    EP2SGX90EF1152C4N

    A detailed introduction to EP2SGX90EF1152C4N, but there is some information related to the EP2SGX series that can indirectly provide some reference.
  • XC6SLX45-2FGG484C

    XC6SLX45-2FGG484C

    ​XC6SLX45-2FGG484C is a field programmable gate array (FPGA) based on 45 nm low-power copper cable technology, which provides the best balance between cost, power, and performance. This FPGA is manufactured by Xilinx and belongs to Spartan ®- The 6 LX series has the following key features and functions:
  • 10 layers of HDI PCB

    10 layers of HDI PCB

    HDI board (High Density Interconnector), that is, high-density interconnection board, is a circuit board with a relatively high line distribution density using micro-blind and buried via technology.The following is about 10 layers of HDI PCB, I hope to help you better understand 10 layers of HDI PCB.
  • High Thermal Conductivity PCB

    High Thermal Conductivity PCB

    The high thermal conductivity FR4 circuit board usually guides the thermal coefficient to be greater than or equal to 1.2, while the thermal conductivity of ST115D reaches 1.5, the performance is good, and the price is moderate. The following is about High Thermal Conductivity PCB related, I hope to help you better understand High Thermal Conductivity PCB.
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    According to the news from zhidongxi on June 28, according to money DJ in Taiwan, China, the cumulative sales of semiconductor equipment in Japan exceeded RMB 75.6 billion in May this year, the highest in the same period over the years

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    After the covering film of FPC circuit board is positioned, it is necessary to heat and pressurize to make the adhesive completely solidified and integrated with the circuit.

  • Precautions for the use of high-speed board plates you must know

    With the rapid development of electronic design and communication fields and the application of cloud computing, products have higher and higher requirements for data volume, and data transmission rates are getting faster and faster. At the same time, the performance of high-speed plates that carry data transmission is also required to be higher and higher.So what should be paid attention to when using high-speed plates?

  • What is semiconductor

    Substances and materials in nature can be divided into three categories: conductors, semiconductors and insulators according to their conductivity. The resistivity of semiconductor is in the range of 1m Ω· cm ~ 1g Ω· cm (the upper limit is taken according to Xie jiakui's electronic circuit, and 1/10 or 10 times of it; because the angle mark is not available, the current description is used temporarily)

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    At present, the dividend ceiling of smart phones is gradually emerging, especially the competition in the Chinese market is particularly fierce. In January, Huawei's sales were 4.72 million units, a slight decrease of 0.4%, and sales were 10.89 billion yuan, a decrease of 1.5%.

  • Non-Apple HDI Big Release

    According to market reports, Huawei and other non-Apple flagship HDI expanded release orders, which will add momentum to the PCB factory's off-season operations in the first quarter of this year.

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