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The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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    10 layers of HDI PCB

    HDI board (High Density Interconnector), that is, high-density interconnection board, is a circuit board with a relatively high line distribution density using micro-blind and buried via technology.The following is about 10 layers of HDI PCB, I hope to help you better understand 10 layers of HDI PCB.
  • 10CL120YF484I7G

    10CL120YF484I7G

    10CL120YF484I7G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications. 10CL120YF484I7G is commonly used in applications such as industrial automation, gaming, and low-power embedded systems. The device is known for its low power consumption, low cost, and high processing capacity, making it an excellent choice for applications where cost and power consumption are critical factors.
  • XC7A75T-2FGG484C

    XC7A75T-2FGG484C

    XC7A75T-2FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM56867A1IFSBG

    BCM56867A1IFSBG

    BCM56867A1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AX115H3F34E2SG

    10AX115H3F34E2SG

    ​10AX115H3F34E2SG is an FPGA (Field Programmable Gate Array) chip, belonging to the Arria 10 GX 1150 series, produced by Intel (formerly Altera Corporation). This chip adopts BGA (Ball Grid Array) packaging form, with 504 I/O interfaces and a packaging form of 1152FBGA
  • XC3S250E-4PQG208I

    XC3S250E-4PQG208I

    XC3S250E-4PQG208I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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