XC95288XL-10TQG144I Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • XC2S200-5PQG208C

    XC2S200-5PQG208C

    XC2S200-5PQG208C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC6VLX240T-2FFG1156I

    XC6VLX240T-2FFG1156I

    ​XC6VLX240T-2FFG1156I is a high-performance, step-down DC-DC power module developed by Analog Devices, a leading semiconductor technology company. This device features a wide input voltage range of 6V to 36V and a maximum output current of 5A.
  • 5AGXMA5G4F35C5G

    5AGXMA5G4F35C5G

    5AGXMA5G4F35C5G Hongtai Quick Electronics is 100% in stock with a complete range of products. We only offer original products with a reputation of 15 years, providing a safe and reliable electronic component procurement platform
  • XCVU7P-L2FLVB2104E

    XCVU7P-L2FLVB2104E

    XCVU7P-L2FLVB2104E The device provides the highest performance and integrated functionality on the 14nm/16nm FinFET node. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements
  • XC7V585T-2FFG1761I

    XC7V585T-2FFG1761I

    ​XC7V585T-2FFG1761I has been optimized for the highest system performance and capacity, resulting in a 2x increase in system performance. The highest performance device using stacked silicon interconnect (SSI) technology.
  • BCM56046B0IFSBLG

    BCM56046B0IFSBLG

    BCM56046B0IFSBLG is a complete DC-DC power supply system that includes a power inductor, power switch, and control circuitry, all housed in a compact surface-mount package. The device operates at a switching frequency of up to 2.25MHz, providing high efficiency and low noise performance. BCM56046B0IFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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