Products
Home > Products > XC7Z045-2FFG900I

XC7Z045-2FFG900I Manufacturers

Responsible excellent and fantastic credit rating standing are our principles, which will help us at a top-ranking position. Adhering towards the tenet of "quality initial, buyer supreme" for XC7Z045-2FFG900I, Our tenet is evident each of the time: to provide good quality solution at competitive rate to clients throughout the planet. We welcome potential purchasers to call us for OEM and ODM orders.
XC7Z045-2FFG900I, Customer's satisfaction is always our quest, creating value for customers is always our duty, a long term mutual-beneficial business relationship is what we've been doing for. We are an absolutely reliable partner for yourself in China. Of course, other services, like consulting, can be offered too.

Related Products

Hot Products

  • LT1764AEFE#PBF

    LT1764AEFE#PBF

    LT1764AEFE#PBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX9-3FTG256I

    XC6SLX9-3FTG256I

    XC6SLX9-3FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7Z020-2CLG400I

    XC7Z020-2CLG400I

    XC7Z020-2CLG400I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10-Layer ELIC HDI PCB

    10-Layer ELIC HDI PCB

    10-Layer ELIC HDI PCB In order to avoid confusion, the American IPC Circuit Board Association proposed to call this kind of product technology a common name for HDI (High Density Intrerconnection) technology. If it is directly translated, it will become a high-density interconnection technology. The following is about 10-Layer ELIC HDI PCB related, I hope to help you better understand 10-Layer ELIC HDI PCB.
  • XCKU15P-2FFVE1517I

    XCKU15P-2FFVE1517I

    XCKU15P-2FFVE1517I is an FPGA (Field Programmable Gate Array) chip from Xilinx, which belongs to the Kintex UltraScale+ family. The chip utilizes 20nm process technology and features 1.4 million logic cells and 5,520 DSP slices.
  • XCZU15EG-3FFVB1156E

    XCZU15EG-3FFVB1156E

    ​XCZU15EG-3FFVB1156E is an FPGA (Field Programmable Gate Array) developed by Xilinx based on Zynq UltraScale+MPSoC architecture. It integrates high-performance computing cores and rich I/O interfaces, supports multiple high-speed data transmission and communication protocols, and is widely used in high-performance computing,
  • Related Blog
  • Reviews

  • The competition of printed circuit board is fierce, and the high-end field has become a new focus

    Printed circuit board (PCB) is a substrate for assembling electronic parts. It is a printed board that forms the connection between points and printed components on the general substrate according to the predetermined design. According to different classification methods

  • Main Classification of Chips

    According to functional classification, it can be divided into four types, mainly memory chips, microprocessors, standard chips, and complex systems on chip (SoCs). According to the types of integrated circuits, they can be divided into three categories: digital chips, analog chips, and hybrid chips.

  • FPC soft board process introduction

    Overview of FPC soft board automatic production line

  • Definition of PCB

    PCB (printed circuit board) is a printed circuit board, which is one of the important components of the electronics industry.

  • Advantages and disadvantages of multilayer boards

    Multilayer boards were invented in 1961. Its production method is generally to make the inner layer graphics first, and then use the printing and etching method to make a single-sided or double-sided substrate, and incorporate it into the designated interlayer, and then heat, press and bond it. As for the subsequent drilling, It is the same as the plated through-hole method of the double-sided board.

  • Microprocessor vs. Integrated Circuit in Electronics Design

    You’re likely to deal with integrated circuits in electronics design. Occasionally, you may face the herculean task of working with a microprocessor. It’s a mistake to assume that designing with a microprocessor is similar to typical ICs.

Send Inquiry