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XC7Z045-2FFG900E Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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    The continuous growth of mobile phone production is driving the demand for HDI boards. China plays an important role in the world's mobile phone manufacturing industry. Since Motorola fully adopted HDI boards to manufacture mobile phones in 2002, more than 90% of mobile phone motherboards have adopted HDI boards. A research report released by market research company In-Stat in 2006 predicted that in the next five years, global mobile phone production will continue to grow at a rate of about 15%. By 2011, global mobile phone sales will reach 2 billion units.

  • What skills are required for PCB proofing

    At present, many PCB proofing companies have established relatively complete test methods, test standards, various test equipment and instruments to detect and identify the qualification and service life of Allegro proofing products. PCB products are not only convenient for standardized assembly of various components, but also for automatic and large-scale mass production. Therefore, PCB proofing with reliable quality has outstanding advantages. So what skills do you need to master to ensure that the PCB proofing work is more outstanding?

  • Classification of electronic components

    Components: products that do not change the molecular composition of raw materials during processing can be called components.

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    Methods to judge the quality of FPC circuit board: 1： Distinguish the quality of the circuit board from the appearance Generally, the appearance of FPC circuit board can be analyzed and judged from three aspects

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    The covering film of FPC circuit board shall be processed by opening the window, but it cannot be processed immediately after being taken out from the cold storage. Especially when the ambient temperature is high and the temperature difference is large, water droplets will condense on the surface.

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    Multilayer boards were invented in 1961. Its production method is generally to make the inner layer graphics first, and then use the printing and etching method to make a single-sided or double-sided substrate, and incorporate it into the designated interlayer, and then heat, press and bond it. As for the subsequent drilling, It is the same as the plated through-hole method of the double-sided board.

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