XC7Z030-1FBG676I Manufacturers

Assume full accountability to satisfy all demands of our consumers; reach ongoing advancements by endorsing the expansion of our purchasers; come to be the final permanent cooperative partner of clients and maximize the interests of clientele for XC7Z030-1FBG676I, Welcome to develop the perfectly and long standing enterprise relationships with our business to make a superb potential with each other. customers' satisfaction is our eternal pursuit!
XC7Z030-1FBG676I, Based on experienced engineers, all orders for drawing-based or sample-based processing are welcomed. We have won a good reputation for outstanding customer service among our overseas customers. We will continue to try the best to offer you good quality products and the best service. We are looking forward to serving you.

Hot Products

  • STM32F042C6T6

    STM32F042C6T6

    STM32F042C6T6 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5SGXEABK2H40I2LG

    5SGXEABK2H40I2LG

    5SGXEABK2H40I2LG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Impedance Control PCB

    Impedance Control PCB

    At high speeds, Impedance control PCB traces are used as transmission lines, and electrical energy can be reflected back and forth, similar to the situation where ripples in lake water encounter obstacles. Controlled impedance traces are designed to reduce electronic reflections and ensure correct conversion between PCB traces and internal connections.
  • XC7VX690T-1FFG1157I

    XC7VX690T-1FFG1157I

    XC7VX690T-1FFG1157I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB is the interconnection hole technology in any layer. This technology is the patent process of Matsushita Electric Component in Japan. It is made of short fiber paper of DuPont's "poly aramid" product thermount, which is impregnated with high-function epoxy resin and film. Then it is made of laser hole forming and copper paste, and copper sheet and wire are pressed on both sides to form a conductive and interconnected double-sided plate. Because there is no electroplated copper layer in this technology, the conductor is only made of copper foil, and the thickness of the conductor is the same, which is conducive to the formation of finer wires.
  • XC7S75-1FGGA676I

    XC7S75-1FGGA676I

    ​XC7S75-1FGGA676I is a Xilinx chip belonging to the Spartan-7 series, manufactured using 28 nanometer technology. It is a field programmable logic array (FPGA) chip with various excellent features. XC7S75-1FGGA676I is equipped with MicroBlaze ™ A soft processor that can achieve performance of over 200 DMIPs and support DDR3 at 800Mb/s.

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